参数资料
型号: FDS6574A
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 20V 16A 8-SOIC
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 16A
开态Rds(最大)@ Id, Vgs @ 25° C: 6 毫欧 @ 16A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 105nC @ 4.5V
输入电容 (Ciss) @ Vds: 7657pF @ 10V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 标准包装
产品目录页面: 1603 (CN2011-ZH PDF)
其它名称: FDS6547ADKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage
V GS = 0 V,
I D = 250 μ A
20
V
? BV DSS
? T J
I DSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
I D = 250 μ A, Referenced to 25 ° C
V DS = 16 V, V GS = 0 V
10
1
mV/ ° C
μ A
I GSSF
I GSSR
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
V GS = 8 V,
V GS = –8 V
V DS = 0 V
V DS = 0 V
100
–100
nA
nA
On Characteristics
(Note 2)
V GS(th)
Gate Threshold Voltage
V DS = V GS ,
I D = 250 μ A
0.4
0.6
1.5
V
? V GS(th)
? T J
R DS(on)
I D(on)
g FS
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
I D = 250 μ A, Referenced to 25 ° C
V GS = 4.5 V, I D = 16 A
V GS = 2.5 V, I D = 15 A
V GS = 1.8 V, I D = 13 A
V GS = 4.5 V, I D = 16 A,T J =125 ° C
V GS = 4.5 V, V DS = 5 V
V DS = 5 V,
I D = 16 A
40
–2.7
4
4.4
5
5.3
115
6
7
9
9
mV/ ° C
m ?
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 10V,
f = 1.0 MHz
V GS = 0 V,
7657
1432
775
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
V DD = 10 V, I D = 1 A,
V GS = 4.5 V, R GEN = 6 ?
19.5
22
173
82
35
36
277
131
ns
ns
ns
ns
Q g
Q gs
Total Gate Charge
Gate–Source Charge
V DS = 10 V,
V GS = 4.5 V
I D = 16 A,
75
9
105
nC
nC
Q gd
Gate–Drain Charge
17
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
2.1
A
V SD
Drain–Source Diode Forward
Voltage
V GS = 0 V,
I S = 2.1 A
(Note 2)
0.56
1.2
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 50°C/W when
mounted on a 1in 2
pad of 2 oz copper
b) 105°C/W when
mounted on a .04 in 2
pad of 2 oz copper
c) 125°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
 
FDS6574A Rev B2(W)
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