参数资料
型号: FDS6576
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET P-CH 20V 11A 8SOIC
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 11A
开态Rds(最大)@ Id, Vgs @ 25° C: 14 毫欧 @ 11A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 60nC @ 4.5V
输入电容 (Ciss) @ Vds: 4044pF @ 10V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
其它名称: FDS6576DKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
BV DSS
T J
I DSS
I GSSF
I GSSR
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
V GS = 0 V, I D = –250 A
I D = –250 A, Referenced to 25 C
V DS = –16 V, V GS = 0 V
V GS = 12 V, V DS = 0 V
V GS = –12 V, V DS = 0 V
–20
–13
–1
100
–100
V
mV/ C
A
nA
nA
On Characteristics
(Note 2)
V GS(th)
V GS(th)
T J
R DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
V DS = V GS , I D = –250 A
I D = –250 A, Referenced to 25 C
V GS = –4.5 V, I D = –11 A
–0.6
–0.83
3.5
8.2
–1.5
14
V
mV/ C
m
On–Resistance
V GS = –2.5 V, I D = –8.8 A
V GS = –4.5 V, I D = –11 A, T J =125 C
11.5
11.1
20
23
I D(on)
On–State Drain Current
V GS = –4.5 V, V DS = –5 V
–25
A
g FS
Forward Transconductance
V DS = –4.5 V,
I D = –11 A
50
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –10 V,
f = 1.0 MHz
V GS = 0 V,
4044
955
504
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
V DD = –10 V, I D = –1 A,
V GS = –4.5 V, R GEN = 6
18
17
124
79
32
31
198
126
ns
ns
ns
ns
Q g
Q gs
Total Gate Charge
Gate–Source Charge
V DS = –10 V,
V GS = –4.5 V
I D = –11 A,
43
7
60
nC
nC
Q gd
Gate–Drain Charge
12
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
–2.1
A
V SD
Drain–Source Diode Forward
Voltage
V GS = 0 V, I S = –2.1 A
(Note 2)
–0.66
–1.2
V
Notes:
1. R JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
JC
is guaranteed by design while R
CA
is determined by the user's board design.
a) 50°C/W when
mounted on a 1in 2
pad of 2 oz copper
b) 105°C/W when
mounted on a .04 in 2
pad of 2 oz copper
c) 125°C/W when mounted
on a minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%
FDS6576 Rev E 3
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