参数资料
型号: FDS6576
厂商: Fairchild Semiconductor
文件页数: 4/5页
文件大小: 0K
描述: MOSFET P-CH 20V 11A 8SOIC
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 11A
开态Rds(最大)@ Id, Vgs @ 25° C: 14 毫欧 @ 11A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 60nC @ 4.5V
输入电容 (Ciss) @ Vds: 4044pF @ 10V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
其它名称: FDS6576DKR
Typical Characteristics
10
3000
8
I D = 12A
V DS = 10V
15V
2500
f = 1MHz
V GS = 0 V
20V
2000
C ISS
6
1500
4
1000
2
0
500
0
C RSS
C OSS
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
100
100
50
V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
SINGLE PULSE
10
R DS(ON) LIMIT
1ms
10ms
40
R JA = 125
T A = 25
/W
100ms
1s
30
1
0.1
V GS = 10V
SINGLE PULSE
10s
DC
20
0.01
R JA = 125 o C/W
T A = 25 o C
10
0
0.01
0.1
1
10
100
0.001
0.01
0.1
1
10
100
V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area.
t 1 , TIME (sec)
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
0.1
0.2
0.1
R JA (t) = r(t) + R JA
R JA = 125 /W
0.05
P(pk)
0.01
0.001
0.02
0.01
SINGLE PULSE
t 1
t 2
T J - T A = P * R JA (t)
Duty Cycle, D = t 1 / t 2
0.0001
0.001
0.01
0.1
1
10
100
1000
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDS6576 Rev E3
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