参数资料
型号: FDS6673BZ_F085
厂商: Fairchild Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET P-CH 30V 14.5A 8-SOIC
标准包装: 2,500
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 14.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 7.8 毫欧 @ 14.5A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 124nC @ 10V
输入电容 (Ciss) @ Vds: 4700pF @ 15V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
FDS6673BZ _F085
P-Channel PowerTrench ? MOSFET
-30V, -14.5A, 7.8m ?
July 2009
General Description
This P-Channel MOSFET is produced using Fairchild
Semiconductor’s advanced Power Trench process that
has been especially tailored to minimize the on-state
resistance.
This device is well suited for Power Management and
Features
Max r DS(on) = 7.8m ?, V GS = -10V, I D = -14.5A
Max r DS(on) = 12m ?, V GS = -4.5V, I D = -12A
Extended V GS range (-25V) for battery applications
HBM ESD protection level of 6.5k V typical (note 3)
load switching applications common in
Computers and Portable Battery Packs.
Notebook
High performance trench technology for extremely low
r DS(on)
High power and current handling capability
RoHS compliant
Qualified to AEC Q101
D
D
D
D
5
6
4
3
SO-8
S
S
S
G
7
8
2
1
MOSFET Maximum Ratings T A = 25°C unless otherwise noted
Symbol
V DS
V GS
Drain to Source Voltage
Gate to Source Voltage
Parameter
Ratings
-30
±25
Units
V
V
I D
P D
Drain Current -Continuous
-Pulsed
Power Dissipation for Single Operation
(Note1a)
(Note1a)
(Note1b)
-14.5
-75
2.5
1.2
A
A
W
(Note1c)
1.0
T J , T STG
Operating and Storage Temperature
-55 to 150
°C
Thermal Characteristics
R θ JA
R θ JC
Thermal Resistance , Junction to Ambient (Note 1a)
Thermal Resistance , Junction to Case (Note 1)
50
25
° C/W
° C/W
Package Marking and Ordering Information
Device Marking
FDS6673BZ
Device
FDS6673BZ _F085
Reel Size
13’’
Tape Width
12mm
Quantity
2500 units
?200 9 Fairchild Semiconductor Corporation
FDS6673BZ _F085 Rev. A
1
www.fairchildsemi.com
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