参数资料
型号: FDS6690AS
厂商: Fairchild Semiconductor
文件页数: 3/8页
文件大小: 0K
描述: MOSFET N-CH 30V 10A 8SOIC
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
系列: PowerTrench®, SyncFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 10A
开态Rds(最大)@ Id, Vgs @ 25° C: 12 毫欧 @ 10A,10V
Id 时的 Vgs(th)(最大): 3V @ 1mA
闸电荷(Qg) @ Vgs: 23nC @ 10V
输入电容 (Ciss) @ Vds: 910pF @ 15V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
其它名称: FDS6690ASDKR
Electrical Characteristics
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
3.5
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = 3.5 A
(Note 2)
0.6
0.7
V
Voltage
T rr
Diode Reverse Recovery Time
I F = 10A,
16
nS
Q rr
Diode Reverse Recovery Charge
d iF /d t = 300 A/μs
(Note 3)
9
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 50°/W when
mounted on a 1 in 2
pad of 2 oz copper
b) 105°/W when
mounted on a .04 in 2
pad of 2 oz copper
c) 125°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
3. See “SyncFET Schottky body diode characteristics” below.
 
FDS6690AS Rev A 2 (X)
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