参数资料
型号: FDV301N
厂商: Fairchild Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH 25V 220MA SOT-23
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
产品目录绘图: SuperSOT-3, SOT-23
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 220mA
开态Rds(最大)@ Id, Vgs @ 25° C: 4 欧姆 @ 400mA,4.5V
Id 时的 Vgs(th)(最大): 1.06V @ 250µA
闸电荷(Qg) @ Vgs: 0.7nC @ 4.5V
输入电容 (Ciss) @ Vds: 9.5pF @ 10V
功率 - 最大: 350mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23
包装: 标准包装
产品目录页面: 1602 (CN2011-ZH PDF)
其它名称: FDV301NDKR
June 2009
FDV301N
Digital FET , N-Channel
General Description
This N-Channel logic level enhancement mode field effect
transistor is produced using Fairchild's proprietary, high cell
density, DMOS technology. This very high density process is
especially tailored to minimize on-state resistance. This
device has been designed especially for low voltage
applications as a replacement for digital transistors. Since
bias resistors are not required, this one N-channel FET can
replace several different digital transistors, with different bias
resistor values.
Features
25 V, 0.22 A continuous, 0.5 A Peak.
R DS(ON) = 5 ? @ V GS = 2.7 V
R DS(ON) = 4 ? @ V GS = 4.5 V.
Very low level gate drive requirements allowing direct
operation in 3V circuits. V GS(th) < 1. 06 V.
Gate-Source Zener for ESD ruggedness.
>6kV Human Body Model
Replace multiple NPN digital transistors with one DMOS
FET.
SOT-23
SuperSOT TM -6
SuperSOT TM -8
SO-8
SOT-223
SOIC-16
Mark:301
INVERTER APPLICATION
Vcc
D
D
OUT
IN
G
S
Absolute Maximum Ratings
G
T A = 25 o C unless other wise noted
S
GND
Symbol
V DSS , V CC
V GSS , V I
Parameter
Drain-Source Voltage, Power Supply Voltage
Gate-Source Voltage, V IN
FDV301N
25
8
Units
V
V
I D , I O
Drain/Output Current
- Continuous
0.22
A
0.5
P D
T J ,T STG
ESD
Maximum Power Dissipation
Operating and Storage Temperature Range
Electrostatic Discharge Rating MIL-STD-883D
0.35
-55 to 150
6.0
W
°C
kV
Human Body Model (100pf / 1500 Ohm)
THERMAL CHARACTERISTICS
R θ JA
Thermal Resistance, Junction-to-Ambient
357
°C/W
?2009 Fairchild Semiconductor Corporation
FDV301N Rev.F 1
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