参数资料
型号: FQB12P20TM
厂商: Fairchild Semiconductor
文件页数: 4/9页
文件大小: 0K
描述: MOSFET P-CH 200V 11.5A D2PAK
产品培训模块: High Voltage Switches for Power Processing
标准包装: 1
系列: QFET™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 200V
电流 - 连续漏极(Id) @ 25° C: 11.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 470 毫欧 @ 5.75A,10V
Id 时的 Vgs(th)(最大): 5V @ 250µA
闸电荷(Qg) @ Vgs: 40nC @ 10V
输入电容 (Ciss) @ Vds: 1200pF @ 25V
功率 - 最大: 3.13W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: TO-263-2
包装: 标准包装
其它名称: FQB12P20TMDKR
Typical Characteristics
1.2
(Continued)
2.5
2.0
1.1
1.5
1.0
1.0
0.9
0.8
※ Notes :
1. V GS = 0 V
2. I D = -250 μ A
0.5
0.0
※ Notes :
1. V GS = -10 V
2. I D = -5.75 A
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
T J , Junction Temperature [ C]
T J , Junction Temperature [ C]
o
Figure 7. Breakdown Voltage Variation
vs. Temperature
12
o
Figure 8. On-Resistance Variation
vs. Temperature
10
2
Operation in This Area
is Limited by R DS(on)
100 μ s
10
1 ms
8
10
10
1. T C = 25 C
2. T J = 150 C
1
0
DC
※ Notes :
o
o
3. Single Pulse
10 ms
6
4
2
10
10
10
10
-1
0
1
2
0
25
50
75
100
125
150
-V DS , Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
T C , Case Temperature [ ℃ ]
Figure 10. Maximum Drain Current
vs. Case Temperature
10
0
D = 0 .5
0 .2
※ N o te s :
1 . Z θ J C ( t ) = 1 . 0 4 ℃ /W M a x .
10
-1
0 .1
2 . D u ty F a c t o r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C ( t )
0 .0 5
0 .0 2
P DM
10
-2
0 .0 1
s in g le p u ls e
t 1
t 2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
?200 8 Fairchild Semiconductor International
Rev. A 1 , Oct 200 8
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