参数资料
型号: FQD1N60CTF
厂商: Fairchild Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 600V 1A DPAK
标准包装: 2,000
系列: QFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 600V
电流 - 连续漏极(Id) @ 25° C: 1A
开态Rds(最大)@ Id, Vgs @ 25° C: 11.5 欧姆 @ 500mA,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 6.2nC @ 10V
输入电容 (Ciss) @ Vds: 170pF @ 25V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
November 2013
FQD1N60C / FQU1N60C
N-Channel QFET ? MOSFET
600 V, 1.0 A, 11.5 ?
Features
? 1 A, 600 V, R DS(on) = 11.5 ? (Max.) @ V GS = 10 V,
I D = 0.5 A
? Low Gate Charge (Typ. 4.8 nC)
? Low Crss (Typ. 3.5 pF)
? 100% Avalanche Tested
? RoHS Compliant
Description
This N-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary
planar stripe and DMOS technology. This advanced
MOSFET technology has been especially tailored to reduce
on-state resistance, and to provide superior switching
performance and high avalanche energy strength. These
devices are suitable for switched mode power supplies,
active power factor correction (PFC), and electronic lamp
ballasts.
D
D
G
S
D-PAK
G
D
S
I-PAK
G
S
Absolute Maximum Ratings
T C = 25°C unless otherwise noted.
Symbol
V DSS
Drain-Source Voltage
Parameter
FQD1N60CTM / FQU1N60CTU
600
Unit
V
I D
Drain Current
- Continuous (T C = 25°C)
- Continuous (T C = 100°C)
1
0.6
A
A
I DM
Drain Current
- Pulsed
(Note 1)
4
A
V GSS
Gate-Source Voltage
± 30
V
E AS
I AR
E AR
dv/dt
P D
T J , T STG
T L
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T A = 25°C)*
Power Dissipation (T C = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8 " from case for 5 seconds
(Note 2)
(Note 1)
(Note 1)
(Note 3)
33
1
2.8
4.5
2.5
28
0.22
-55 to +150
300
mJ
A
mJ
V/ns
W
W
W/°C
°C
°C
Thermal Characteristics
Symbol
R θ JC
R θ JA
Parameter
Thermal Resistance, Junction-to-Case, Max.
Thermal Resistance, Junction-to-Ambient (minimum pad of 2 oz copper), Max.
Thermal Resistance, Junction-to-Ambient (* 1 in 2 pad of 2 oz copper), Max.
FQD1N60CTM /
FQU1N60CTU
4.53
110
50
Unit
°C / W
?2003 Fairchild Semiconductor Corporation
FQD1N60C / FQU1N60C Rev. C1
1
www.fairchildsemi.com
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