参数资料
型号: FQD2P40TM
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 400V 1.56A DPAK
标准包装: 2,500
系列: QFET™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 400V
电流 - 连续漏极(Id) @ 25° C: 1.56A
开态Rds(最大)@ Id, Vgs @ 25° C: 6.5 欧姆 @ 780mA,10V
Id 时的 Vgs(th)(最大): 5V @ 250µA
闸电荷(Qg) @ Vgs: 13nC @ 10V
输入电容 (Ciss) @ Vds: 350pF @ 25V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: TO-252,(D-Pak)
包装: 带卷 (TR)
November 2013
FQD2P40
P -Channel QFET ? MOSFET
-4 00 V, -1.56 A, 6.5 ?
Description
This P-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary planar
stripe and DMOS technology. This advanced MOSFET
technology has been especially tailored to reduce on-state
resistance, and to provide superior switching performance
and high avalanche energy strength. These devices are
suitable for switched mode power supplies, audio amplifier,
DC motor control, and variable switching power applications..
D
Features
? -1.56 A, - 40 0 V, R DS(on) = 6.5 ? (Max.) @ V GS = - 10 V,
I D = -0.78 A
? Low Gate Charge (Typ. 10 nC)
? Low Crss (Typ. 6.5 pF)
? 100% Avalanche Tested
? RoHS Compliant
S
G
G
S
D-PAK
D
Absolute Maximum Ratings
T C = 25°C unless otherwise noted.
Symbol
V DSS
Drain-Source Voltage
Parameter
FQD2P40 TM
-400
Unit
V
I D
Drain Current
- Continuous (T C = 25°C)
- Continuous (T C = 100°C)
-1.56
-0.98
A
A
I DM
Drain Current
- Pulsed
(Note 1)
-6.24
A
V GSS
Gate-Source Voltage
± 30
V
E AS
I AR
E AR
dv/dt
P D
T J , T STG
T L
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T A = 25°C) *
Power Dissipation (T C = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range
Maximum lead temperature for soldering,
1/8 ” from case for 5 seconds
(Note 2)
(Note 1)
(Note 1)
(Note 3)
120
-1.56
3.8
-4.5
2.5
38
0.3
-55 to +150
300
mJ
A
mJ
V/ns
W
W
W/°C
°C
°C
Thermal Characteristics
Thermal Resistance, Junction to Ambient (*1 in Pad of 2-oz Copper), Max.
Symbol
R ? JC
R ? JA
Parameter
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max.
2
FQD2P40TM
3.2 9
110
50
Unit
o C/W
?200 8 Fairchild Semiconductor Corporation
FQD2P40 Rev. C 0
1
www.fairchildsemi.com
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