参数资料
型号: FQP50N06
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 60V 50A TO-220
产品培训模块: High Voltage Switches for Power Processing
产品目录绘图: MOSFET TO-220 Pkg
标准包装: 50
系列: QFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 50A
开态Rds(最大)@ Id, Vgs @ 25° C: 22 毫欧 @ 25A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 41nC @ 10V
输入电容 (Ciss) @ Vds: 1540pF @ 25V
功率 - 最大: 120W
安装类型: 通孔
封装/外壳: TO-220-3
供应商设备封装: TO-220
包装: 管件
产品目录页面: 1607 (CN2011-ZH PDF)
其它名称: FQP50N06-ND
FQP50N06FS
FQP50N06
60V N-Channel MOSFET
QFET
TM
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as automotive, DC/
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50A, 60V, R DS(on) = 0.022 ? @V GS = 10 V
Low gate charge ( typical 31 nC)
Low Crss ( typical 65 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
175 ° C maximum junction temperature rating
DC converters, and high efficiency switching for power
management in portable and battery operated products.
D
!
"
G !
! "
"
"
G D S
Absolute Maximum Ratings
TO-220
FQP Series
T C = 25°C unless otherwise noted
!
S
Symbol
V DSS
Drain-Source Voltage
Parameter
FQP50N06
60
Units
V
I D
Drain Current
- Continuous (T C = 25°C)
- Continuous (T C = 100°C)
50
35.4
A
A
I DM
Drain Current
- Pulsed
(Note 1)
200
A
V GSS
Gate-Source Voltage
± 25
V
E AS
I AR
E AR
dv/dt
P D
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T C = 25°C)
- Derate above 25°C
(Note 2)
(Note 1)
(Note 1)
(Note 3)
490
50
12
7.0
120
0.8
mJ
A
mJ
V/ns
W
W/°C
T J , T STG
T L
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8 " from case for 5 seconds
-55 to +175
300
°C
°C
Thermal Characteristics
Symbol
R θ JC
R θ CS
R θ JA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
Thermal Resistance, Junction-to-Ambient
Typ
--
0.5
--
Max
1.24
--
62.5
Units
°C / W
°C / W
°C / W
?2003 Fairchild Semiconductor Corporation
Rev. A2, March 2003
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