参数资料
型号: FSB50550T
厂商: Fairchild Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: IC SMART POWER MOD 3.5A SPM23-AC
产品培训模块: Smart Power
产品变化通告: Pkg Pin Hole Shape Change 02/June/2008
标准包装: 15
系列: SPM®
类型: FET
配置: 3 相
电流: 1.8A
电压: 500V
电压 - 隔离: 1500Vrms
封装/外壳: SPM23AC
产品目录页面: 1222 (CN2011-ZH PDF)
Absolute Maximum Ratings
Inverter Part (each MOSFET unless otherwise specified.)
Symbol
V DSS
*I D 25
*I D 80
Parameter
Drain-Source Voltage of Each MOSFET
Each MOSFET Drain Current, Continuous T C = 25°C
Each MOSFET Drain Current, Continuous T C = 80°C
Conditions
Rating
500
1.8
1.2
Unit
V
A
A
*I DP
*P D
Each MOSFET Drain Current, Peak
Maximum Power Dissipation
T C = 25°C, PW < 100 ? s
T C = 25°C, For Each MOSFET
3.5
4.5
A
W
Control Part (each HVIC unless otherwise specified.)
Symbol
V CC
V BS
V IN
Parameter
Control Supply Voltage
High-side Bias Voltage
Input Signal Voltage
Conditions
Applied Between V CC and COM
Applied Between V B and V S
Applied Between IN and COM
Rating
20
20
-0.3 ~ V CC + 0.3
Unit
V
V
V
Thermal Resistance
Symbol
R ? JC
Parameter
Junction to Case Thermal Resistance
Conditions
Each MOSFET under Inverter Oper-
ating Condition (1st Note 1)
Rating
8.6
Unit
°C/W
Total System
Symbol
T J
T STG
V ISO
Parameter
Operating Junction Temperature
Storage Temperature
Isolation Voltage
Conditions
60 Hz, Sinusoidal, 1 Minute, Con-
nect Pins to Heat Sink Plate
Rating
-20 ~ 150
-50 ~ 150
1500
Unit
°C
°C
V rms
1st Notes:
1. For the measurement point of case temperature T C , please refer to Figure 4.
2. Marking “ * “ is calculation value or design factor.
?2007 Fairchild Semiconductor Corporation
FSB50550T Rev. C4
2
www.fairchildsemi.com
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FSB50550T_07 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Smart Power Module (SPM㈢)
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FSB50550TB2 功能描述:IGBT 模块 1.2A 500V SPM5 RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSB50550U 功能描述:IGBT 模块 500V/1.2A Motion-SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSB50550US 功能描述:IGBT 模块 500V, 1.2A RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装: