参数资料
型号: FSBB15CH60F
厂商: Fairchild Semiconductor
文件页数: 1/14页
文件大小: 0K
描述: MODULE SPM 600V SPM27-CA
产品变化通告: Wire Bonding Change 06/April/2007
标准包装: 10
系列: SPM™
类型: IGBT
配置: 3 相
电流: 15A
电压: 600V
电压 - 隔离: 2500Vrms
封装/外壳: SPM27CA
January 2014
FSBB15CH60F
Motion SPM ? 3 Series
Features
? UL Certified No. E209204 (UL1557)
? 600 V - 15 A 3-Phase IGBT Inverter with Integral Gate
Drivers and Protection
? Built-In Thermal Shutdown Function
? Low-Loss, Short-Circuit Rated IGBTs
? Very Low Thermal Resistance Using Al 2 O 3 DBC Sub-
strate
? Dedicated Vs Pins Simplify PCB Layout
? Separate Open-Emitter Pins from Low-Side IGBTs for
Three-Phase Current Sensing
General Description
FSBB15CH60F is a Motion SPM ? 3 module providing a
fully-featured, high-performance inverter output stage
for AC Induction, BLDC, and PMSM motors. These mod-
ules integrate optimized gate drive of the built-in IGBTs
to minimize EMI and losses, while also providing multi-
ple on-module protection features including under-volt-
age lockouts, over-current shutdown, and fault reporting.
The built-in, high-speed HVIC requires only a single sup-
ply voltage and translates the incoming logic-level gate
inputs to the high-voltage, high-current drive signals
required to properly drive the module's internal IGBTs.
Separate negative IGBT terminals are available for each
phase to support the widest variety of control algorithms.
? Single-Grounded Power Supply
? Isolation Rating: 2500 V rms / min.
Applications
? Motion Control - Home Appliance / Industrial Motor
Related Resources
? AN-9035 - Motion SPM 3 Series Ver.2 User’s Guide
Figure 1. Package Overview
Package Marking and Ordering Information
Device
FSBB15CH60F
Device Marking
FSBB15CH60F
Package
SPMCA-027
Packing Type
Rail
Quantity
10
?2006 Fairchild Semiconductor Corporation
FSBB15CH60F Rev. C6
1
www.fairchildsemi.com
相关PDF资料
PDF描述
FSBB20CH60CL SMART POWER MODULE 20A SPM27-CB
FSBB20CH60CT MODULE ADV MOTION SPM SPM27-CC
FSBB20CH60C MODULE MOTION-SPM 600V SPM27-CC
FSBB20CH60SL MODULE SPM 600V 20A SPM27-CA
FSBB30CH60F IC SMART PWR MODULE SPM27-EA
相关代理商/技术参数
参数描述
FSBB20CH60 功能描述:IGBT 模块 HIGH_POWER RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60B 功能描述:IGBT 模块 600V -20A 3-phase RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60BT 功能描述:IGBT 模块 600V -20A 3-phase RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60C 功能描述:IGBT 模块 600V 20A SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60CL 功能描述:IGBT 模块 20A, Motion-SPM RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装: