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参数资料
| 型号： | GL100MN0MP1 |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 6/11页 |
| 文件大小： | 0K |
| 描述： | EMITTER IR 940NM GP 3.0MW SMD |
| 产品变化通告： | Emitter Chip Change 10/Aug/2007 |
| 标准包装： | 1 |
| 电流 - DC 正向(If)： | 50mA |
| 波长： | 940nm |
| 正向电压： | 1.2V |
| 视角： | 20° |
| 方向： | 顶视图 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 2-SMD，无引线 |
| 包装： | 标准包装 |
| 其它名称： | 425-2706-6 |
GL100MN0MPx
■ Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50 % deg-
radation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the Reflow Soldering Temperature Profile shown in Fig. 10. Sharp
recommends checking the process to make sure these parameters are not exceeded; exceeding these param-
eters can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires,
or other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures ≤ 260° for ≤ 3 seconds. Do not dip-solder or V PS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
200°C
1 ~ 4°C/s
165°C MAX.
1 ~ 4°C/s
1 ~ 4°C/s
25°C
10 s MAX.
60 s MAX.
120 s MAX.
90 s MAX.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A00601EN
6
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| GL390V | EMITTER IR 950NM 9MW T/H |
| GL4800E0000F | EMITTER IR 950NM 3.0MW TH |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| GL100MN0MP1M | 功能描述:红外发射源 940nm 1-2.5mW SMT IRED 1.5Kpcs RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| GL100MN1MP | 功能描述:红外发射源 SMT IRED 10 940nm 6mW 2Kpcs (Side Mt.) RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| GL100MN1MP1 | 功能描述:红外发射源 940nm 6mW SMT IRED 1.5Kpcs RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| GL100MN3MP | 功能描述:红外发射源 940nm 6mW SMT IRED 2Kpcs RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| GL100MN3MP1 | 功能描述:红外发射源 940nm 6mW SMT IRED 1.5Kpcs RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
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