参数资料
型号: HIP1011EVAL1
厂商: Intersil
文件页数: 3/5页
文件大小: 0K
描述: PCI HOT PLUG EVALUATION BOARD
标准包装: 1
主要目的: 电源管理,热交换控制器
已用 IC / 零件: HIP1011
已供物品:
Application Note 9737
can not be adjusted independently. As an example,
suppose we choose ROCSET = 6k ? . From Table 1, we
?nd that the 12V supply will trip at approximately 750mA,
and the -12V supply will trip at approximately 180mA.
2. Choose the 3V and 5V sense resistors to set the over
current level for each supply. For example, if the sense
resistor in the 5V supply is 25m ? , then from Table 1, we
can calculate that the over current trip point will be
((100 μ A x 6k ? )/17)/(.025) = 1.4A. Similarly, if the sense
resistor in the 3.3V supply is 10m ? then its over current
trip point will be 4.5A.
TABLE 1.
I have 2 non-PCI Hot Plug applications where I want
to control the 3 positive voltage supplies or just the
3.3V and 5V supplies, can I use the HIP1011 for these
applications?
Yes, the HIP1011 can be used in these applications. Since
the HIP1011 does not self monitor the -12V supply for a UV
condition, short the M12VO and M12VG pins together. You
now have a +3.3V, +5V and +12V controller with full OC and
UV fault monitoring and reporting. By additionally shorting
the 12VG pin to the V CC pin to disable the UV feature, the
+3.3V and +5V supplies are still monitored for OC events.
SUPPLY
+3.3V I OC
+5.0V I OC
+12V I OC
-12V I OC
HOW TO DETERMINE NOMINAL ( ± 10%)I OC
FOR EACH SUPPLY
((100 μ A x R OCSET )/13.3)/R SENSE
((100 μ A x R OCSET )/17)/R SENSE
(100 μ A x R OCSET )/0.8
(100 μ A x R OCSET )/3.3
Additionally, for +3.3V and +5V control, Intersil also has the
HIP1012 hot swap power controller that can control +3.3V
and +5V or +5V and +12V.
Can I plug a HIP1011 equipped adapter card into a
CompactPCI backplane?
Yes, the HIP1011 can be used on a CompactPCI adapter card
application. In the present pin field in the CPCI connector V CC ,
Does the HIP1011 implementation allow for soft
start on the voltage supplies and can I adjust it?
Yes, the HIP1011 implementation does allow the user to
select the rate of ramp up on the voltage supplies. This start
up ramp minimizes in-rush current at start up while the bulk
capacitors charge. The ramp is created by placing a
capacitor on M12VG to M12VO, 12VG to 12VO and 3V5VG
to ground. These capacitors are each charged up by a
nominal 25 μ A current during turn on. A note of caution when
choosing capacitor values. The 3.3V and 5V UV circuitry is
enabled after the voltage on 12VG is less than 400mV.
Therefore, if the capacitor on the pin 3 (3V5VG) is more than
50% larger than the capacitor on pin 14 (12VG) a false UV
may be detected during start up. The same value for all 3
gate timing capacitors is recommended. The minimum value
for PCI applications is 0.033 μ F as a smaller value may
cause overcurrent faults at power up.
The gate capacitors must be discharged when a fault is
detected to turn off the power FETs. Thus, larger caps slow
the response time. If the gate capacitors are too large the
HIP1011 may not be able to protect the bus or the power
FETs. Doubling the gate capacitance will double the
response time. For example, with 0.033 μ F gate capacitance,
the response time will be less than 6 μ s.
There is both a V CC and a 12VIN pin; what do I do
with them, tie them together or leave them
separate?
The inclusion of separate pins for V CC and 12VIN is to offer
the ?exibility in design of the HIP1011 controller function to
be either powered by a separate unswitched supply (tie V CC
to unswitched supply) or to use the same 12V supply as that
being controlled by the HIP1011 (tie V CC to 12VIN).
Ideally, V CC should be ?ltered by an RC network from 12VIN
if both pins are tied to the same supply. This will preclude the
possibility a short resetting the power on reset latch.
+12V, -12V, +5V, +3.3V all connect simultaneously after the
ground connection is made. A pull down resistor from the
PWRON pin to ground ensures that upon positive contact the
HIP1011 is initially off and in a stable condition. The last pin to
connect is the board present pin which is tied to ground on the
backplane. With a 5V logic inverter connected from the board
present pin to the HIP1011 PWRON pin, once the board is fully
inserted the PWRON state goes high turning on the HIP1011
and powering up the adapter card. See Tech Brief TB358 and
the HIP1011EVAL2 board for additional implementation
information.
This connection sequence is necessary primarily to prevent the
integrated +12V PMOS device from being in an ON state at the
time of insertion contact. Due to capacitive load charging, it is
likely that excessive dissipated power in the PMOS would occur
with possible destruction upon an interrupted insertion cycle.
With the described requirement met, the HIP1011 upon
positive contact, will be in a stable state with all the bus
switches off and awaiting a PWRON signal.
Does the HIP1011 monitor for overvoltage (OV)
occurrences on the voltage supply bus?
No, the HIP1011 is designed to work with well behaved bus
voltages regulated elsewhere in the system. If OV protection is
desired, add a zener diode in parallel with the load. Size the
zener to draw current only during the overvoltage. The zener
current will latch the HIP1011 off in response to an over voltage
condition.
Are there PCB layout design best practices to
follow? What are they?
As with most innovative ICs performing critical tasks there are
crucial PCB layout best practices to follow for optimal
performance. For example (reference Figure 1), the PCB traces
that connect each R SENSE must not carry any load current.
This can be accomplished by running two dedicated traces
directly from the sense resistor to the HIP1011.
3
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HIP1012A 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Dual Power Distribution Controller
HIP1012A_04 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Dual Power Distribution Controller
HIP1012ACB 功能描述:IC CTRLRL HOT PLUG DUAL 14-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP(3x3) 包装:管件