参数资料
型号: HIP2100EIBZ
厂商: Intersil
文件页数: 6/12页
文件大小: 0K
描述: IC DRIVER HALF BRIDGE 8EPSOIC
标准包装: 98
配置: 半桥
输入类型: PWM
延迟时间: 20ns
电流 - 峰: 2A
配置数: 1
输出数: 2
高端电压 - 最大(自引导启动): 114V
电源电压: 9 V ~ 14 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
供应商设备封装: 8-SOIC-EP
包装: 管件
产品目录页面: 1239 (CN2011-ZH PDF)
HIP2100
Pin Descriptions
SYMBOL
V DD
HB
HO
HS
HI
LI
V SS
LO
EPAD
DESCRIPTION
Positive Supply to lower gate drivers. De-couple this pin to V SS . Bootstrap diode connected to HB.
High-Side Bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin.
Bootstrap diode is on-chip.
High-Side Output. Connect to gate of High-Side power MOSFET.
High-Side Source connection. Connect to source of High-Side power MOSFET. Connect negative side of bootstrap capacitor to
this pin.
High-Side input.
Low-Side input.
Chip negative supply, generally will be ground.
Low-Side Output. Connect to gate of Low-Side power MOSFET.
Exposed Pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.
Timing Diagrams
LI
HI ,
LI
HI
t HPLH ,
t LPLH
t HPHL ,
t LPHL
LO
HO ,
LO
FIGURE 3.
Typical Performance Curves
10
HO
10
t MON
FIGURE 4.
t MOFF
1
1
T = +150°C
T = -40°C
T = +125°C
T = +25°C
0.1
T = +150°C
T = +125°C
T = +25°C
T = -40°C
0.1
0.01
10k
100k
1M
0.01
10k
100k
1M
FREQUENCY (Hz)
FIGURE 5. OPERATING CURRENT vs FREQUENCY
6
FREQUENCY (Hz)
FIGURE 6. HB TO V SS OPERATING CURRENT vs
FREQUENCY
FN4022.14
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