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参数资料
| 型号： | HMC449 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 倍频器 |
| 英文描述： | 27000 MHz - 33000 MHz RF/MICROWAVE FREQUENCY DOUBLER |
| 封装： | 1.20 X 1.10 MM, 0.10 MM HEIGHT, DIE-4 |
| 文件页数： | 4/6页 |
| 文件大小： | 235K |
| 代理商： | HMC449 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
RF Input (Vcc= +5V)
+20 dBm
Supply Voltage (Vdd)
+6.0 Vdc
Channel Temperature
175 °C
Continuous Pdiss (T= 85 °C)
(derate 8.3 mW/°C above 85 °C)
744 mW
Thermal Resistance
(junction to die bottom)
121 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
Typical Supply Current vs. Vdd
Vdd (V)
Idd (mA)
4.5
49
5.0
50
5.5
51
Note:
Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
HMC449
v01.1007
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 27 - 33 GHz OUTPUT
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