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参数资料
| 型号： | HMC580ST89E |
| 厂商： | Hittite Microwave Corporation |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | IC GAIN BLOCK AMP SOT89 |
| 标准包装： | 1 |
| 频率： | 0Hz ~ 1GHz |
| P1dB： | 19dBm |
| 增益： | 17dB |
| 噪音数据： | 2.8dB |
| RF 型： | 通用 |
| 电源电压： | 5V |
| 电流 - 电源： | 110mA |
| 封装/外壳： | TO-243AA |
| 包装： | 标准包装 |
| 其它名称： | 1127-1059-6 |
HMC580ST89 / 580ST89E
v04.0710
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 1 GHz
Absolute Maximum Ratings
Collector Bias Voltage (Vcc)
RF Input Power (RFIN)(Vcc = +4.2 Vdc)
Junction Temperature
Continuous Pdiss (T = 85 °C)
(derate 9 mW/°C above 85 °C)
Thermal Resistance
(junction to lead)
Storage Temperature
Operating Temperature
ESD Sensitivity (HMB)
+5.5 Vdc
+10 dBm
150 °C
0.59 W
110 °C/W
-65 to +150 °C
-40 to +85 °C
Class 1C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
8
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL:
MOLDING COMPOUND MP-180S OR EQUIVALENT.
2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.
3. LEAD PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS]
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking [3]
HMC580ST89
HMC580ST89E
Low Stress Injection Molded Plastic
RoHS-compliant Low Stress Injection Molded Plastic
Sn/Pb Solder
100% matte Sn
MSL1
MSL1
[1]
[2]
H580
XXXX
H580
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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