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参数资料
| 型号： | HMMC-1002 |
| 元件分类： | 衰减器 |
| 英文描述： | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| 封装： | CHIP |
| 文件页数： | 4/8页 |
| 文件大小： | 97K |
| 代理商： | HMMC-1002 |
7-15
Figure 2. HMMC-1002 Bonding Pad Locations.
Notes:
1. All dimensions in microns and shown to center of bond pad.
2. DCin, V1, DCout, and V2 bonding pads are 75 x 75 microns.
3. RF input and output bonding pads are 60 x 70 microns.
4. Chip thickness: 127
± 15 m.
2.0 mil
nom. gap
RFIN
RFOUT
DCIN
V1
DCOUT
V2
4 Wire Bonds using
0.7 mil dia. Gold Bond Wire
(Length NOT important)
TC721A
Figure 3. HMMC-1002 Assembly Diagram.
584
476
887
994
1410
0
233
0
233
610
RF
IN
RF
OUT
1470
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PDF描述 |
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| HMMC-2007 | 0 MHz - 8000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.4 dB INSERTION LOSS |
| HMMC-5022 | 2000 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMMC-5021 | 2000 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMMC-5027 | 2000 MHz - 26500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMMC-5034 | 37000 MHz - 43000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HMMC-1015 | 制造商:Agilent Technologies 功能描述:VOLT VARIABLE ATTENUATOR 40DB ATTENUATION 26500MHZ 40DB ATTE - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-2006 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:DC-6 GHz Unterminated SPDT Switch |
| HMMC-2007 | 制造商:Agilent Technologies 功能描述:RF SWIT SPDT DC TO 8GHZ 38DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-2027 | 制造商:Agilent Technologies 功能描述:RF SWIT SPDT 0MHZ TO 26.5GHZ 27DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3002 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
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