参数资料
型号: HUF76629D3S
厂商: Fairchild Semiconductor
文件页数: 1/10页
文件大小: 0K
描述: MOSFET N-CH 100V 20A DPAK
标准包装: 1,800
系列: UltraFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 20A
开态Rds(最大)@ Id, Vgs @ 25° C: 52 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 46nC @ 10V
输入电容 (Ciss) @ Vds: 1285pF @ 25V
功率 - 最大: 110W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 管件
HUF76629D3S
Data Sheet
N-Channel Logic Level UltraFET Power MOSFET
100 V, 20 A, 54 m?
Packaging
JEDEC TO-252AA
DRAIN
(FLANGE)
GATE
SOURCE
Symbol
D
October 20 13
Features
? Ultra Low On-Resistance
- r DS(ON) = 0.052 ?, V GS = 10V
- r DS(ON) = 0.054 ?, V GS = 5V
? Simulation Models
- Temperature Compensated PSPICE? and SABER?
Electriecal Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
? Peak Current vs Pulse Width Curve
? UIS Rating Curve
? Switching Time vs R GS Curves
Ordering Information
PART NUMBER
PACKAGE
BRAND
G
HUF76629D3ST
TO- 252AA
76629D
S
Absolute Maximum Ratings
T C = 25 o C, Unless Otherwise Specified
HUF76629D3S T
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V DSS
Drain to Gate Voltage (R GS = 20k ? ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V GS
Drain Current
Continuous (T C = 25 o C, V GS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Continuous (T C = 25 o C, V GS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Continuous (T C = 100 o C, V GS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Continuous (T C = 100 o C, V GS = 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P D
Derate Above 25 o C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T J , T STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T L
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T pkg
100
100
± 16
20
20
20
20
Figure 4
Figures 6, 17, 18
110
0.74
-55 to 175
300
260
V
V
V
A
A
A
A
W
W/ o C
o C
o C
o C
NOTES:
1. T J = 25 o C to 150 o C.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html
For severe environments, see our Automotive HUFA series.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
?2001 Fairchild Semiconductor Corporation
HUF76629D3S Rev. C0
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