- 您现在的位置：买卖IC网 > PDF目录261241 > IBM25EMPPC740LDBA3330 32-BIT, 333 MHz, RISC PROCESSOR, CBGA255 PDF资料下载
参数资料
| 型号： | IBM25EMPPC740LDBA3330 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 333 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 42/50页 |
| 文件大小： | 600K |
| 代理商： | IBM25EMPPC740LDBA3330 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页当前第42页第43页第44页第45页第46页第47页第48页第49页第50页
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 43
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Thermagon, Inc.
216-741-7659
3256 West 25th Street
Cleveland, OH 44109-1668
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067
AI Technology (e.g. EG7655)
609-882-2332
1425 Lower Ferry Road
Trent, NJ 08618
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.
T
J = TA + TR + (
θ
JC +
θ
INT +
θ
SA)
× P
D
Where:
T
J is the die-junction temperature
T
A is the inlet cabinet ambient temperature
T
R is the air temperature rise within the system cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the thermal resistance of the thermal interface material
θ
SA is the heat sink-to-ambient thermal resistance
P
D is the power dissipated by the device
Typical die-junction temperatures (T
J) should be maintained less than the value specified in Table “Package
Thermal Characteristics1,” on page 8. The temperature of the air cooling the component greatly depends
upon the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic
cabinet inlet-air temperature (T
A) may range from 30 to 40
°C. The air temperature rise within a cabinet (T
R)
may be in the range of 5 to 10
°C. The thermal resistance of the interface material (θ
INT) is typically about 1
°C/
W. Assuming a T
A of 30
°C, a T
R of 5
°C, a CBGA package θ
JC = 0.03, and a power dissipation (PD) of 5.0 watts,
the following expression for T
J is obtained.
Die-junction temperature: T
J = 30
°C + 5°C + (0.03°C/W +1.0°C/W + θ
SA)
× 5W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
SA) versus air flow velocity
is shown in Figure 23.
相关PDF资料 |
PDF描述 |
|---|---|
| IBM25EMPPC740LDBF4000 | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 |
| IBM25EMPPC740LFBC4000 | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 |
| IBM25EMPPC750LCBA4660 | 32-BIT, 466 MHz, RISC PROCESSOR, CBGA360 |
| IBM25EMPPC750LDBF4660 | 32-BIT, 466 MHz, RISC PROCESSOR, CBGA360 |
| IBM25EMPPC750LEBB3000 | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25EMPPC740LEBA300 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC740LEBA333 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC740LEBA366 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC740LEBA400 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC740LEBA466 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
发布紧急采购，3分钟左右您将得到回复。