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参数资料
| 型号： | IBM25PPC750CXEJP5513T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | 27 X 27 MM, PLASTIC, BGA-256 |
| 文件页数： | 19/44页 |
| 文件大小： | 416K |
| 代理商： | IBM25PPC750CXEJP5513T |
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Data Sheet
PowerPC 750CXe RISC Microprocessor
Preliminary
PowerPC 750CXe Dimension and Physical Signal Assignments
Page 18 of 36
750cxe_DD3.1_Dev_3_gen_mkt.fm.1.5
April 8, 2004
5. PowerPC 750CXe Dimension and Physical Signal Assignments
IBM offers a plastic ball grid array, PBGA, which supports 256 balls as the PowerPC 750CXe package. This
package is JEDEC MSL-3 and should be handled accordingly.
Note: Use the A01 corner designator for correct placement. The A01 corner identifier dot is approxi-
mately 1.27 mm in diameter and is marked on the top of the part. Some packages also have a chamfer on
the A01 corner, as shown in Figure 5-1.
The following sections contain several views of the package, pin information, and a pin listing.
Figure Description
Figure Number and Page
Shows the pinout of the 256 PBGA package as viewed from the solder ball surface.
Shows a side profile of the 256 PBGA package including the height from the top of the cop-
per heat spreader to the bottom of the solder balls.
Provides a more detailed side profile including the encapsulant (glob) referenced.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25PPC750CXEJP7012T | 制造商:IBM Microelectronics 功能描述:MPU 750XX RISC 32BIT 0.18UM 600MHZ 1.8V/2.5V 256BGA - Trays 制造商:IBM 功能描述:IBM IBM25PPC750CXEJP7012T Co-Processors |
| IBM25PPC750CXEJP7013T | 制造商:IBM 功能描述:IBMIBM25PPC750CXEJP7013T OEM EOL151207 |
| IBM25PPC750FL-GR0123V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR0124V | 制造商:IBM 功能描述:MPU 750XX RISC 32BIT - Trays |
| IBM25PPC750FL-GR0133T | 制造商:IBM 功能描述:IBMIBM25PPC750FL-GR0133T CSOI9SG LOGIC P |
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