
PLL BUILDING BLOCK
MDS 663 D
7
Revision 062904
In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 297-1 201 ● www.icst.com
ICS663
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Ordering Information
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
ICS663M
Tubes
8-pin SOIC
0 to +70
° C
ICS663MT
ICS663M
Tape and Reel
8-pin SOIC
0 to +70
° C
ICS663MI
Tubes
8-pin SOIC
-40 to +85
° C
ICS663MIT
ICS663MI
Tape and Reel
8-pin SOIC
-40 to +85
° C
INDEX
AREA
1 2
8
D
E
SEATING
PLANE
A1
A
e
- C -
B
.10 (.004)
C
L
H
h x 45
Millimeters
Inches
Symbol
Min
Max
Min
Max
A
1.35
1.75
.0532
.0688
A1
0.10
0.25
.0040
.0098
B
0.33
0.51
.013
.020
C
0.19
0.25
.0075
.0098
D
4.80
5.00
.1890
.1968
E
3.80
4.00
.1497
.1574
e
1.27 BASIC
0.050 BASIC
H
5.80
6.20
.2284
.2440
h
0.25
0.50
.010
.020
L
0.40
1.27
.016
.050
α
0
°
8
°
0
°
8
°