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| 型号： | ICS841S012DKILF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 5/23页 |
| 文件大小： | 0K |
| 描述： | IC FREQ SYNTHESIZER 56VFQFN |
| 标准包装： | 260 |
| 系列： | HiPerClockS™, PCI Express® (PCIe) |
| 类型： | 时钟/频率合成器，多路复用器 |
| PLL： | 是 |
| 主要目的： | PCI Express（PCIe） |
| 输入： | LVCMOS，LVTTL，晶体 |
| 输出： | HCSL，LVCMOS，LVTTL |
| 电路数： | 1 |
| 比率 - 输入:输出： | 2:12 |
| 差分 - 输入:输出： | 是/无 |
| 频率 - 最大： | 250MHz |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 56-VFQFN 裸露焊盘 |
| 供应商设备封装： | 56-VFQFP-EP（8x8） |
| 包装： | 托盘 |
ICS841S012BKI REVISION A NOVEMBER 10, 2009
13
2009 Integrated Device Technology, Inc.
ICS841S012I Data Sheet
CRYSTAL-TO-0.7V DIFFERENTIAL HCSL/LVCMOS FREQUENCY SYNTHESIZER
FIGURE 5. P.C.ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
VFQFN EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electr ical perfor mance, a land patter n must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in
Figure 5. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias.
The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”)
are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended
to determine the minimum number needed. Maximum thermal
and electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as
many vias connected to ground as possible. It is also
recommended that the via diameter should be 12 to 13mils (0.30
to 0.33mm) with 1oz copper via barrel plating. This is desirable to
avoid any solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed pad/
slug and the thermal land. Precautions should be taken to
eliminate any solder voids between the exposed heat slug and
the land pattern. Note: These recommendations are to be used
as a guideline only. For further information, refer to the Application
Note on the
Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadframe Base Package, Amkor
Technology.
THERMAL VIA
LAND PATTERN
SOLDER
PIN
SOLDER
PIN PAD
PIN
GROUND PLANE
EXPOSED HEAT SLUG
(GROUND PAD)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS841S012DKILFT | 功能描述:IC FREQ SYNTHESIZER 56VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:HiPerClockS™, PCI Express® (PCIe) 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP（0.209"，5.30mm 宽） 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT |
| ICS841S012I | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:Crystal-to-0.7V Differential HCSL/LVCMOS Frequency Synthesizer |
| ICS841S01BG | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:PCI EXPRESS⑩ CLOCK GENERATOR |
| ICS841S01BGLF | 功能描述:IC CLK GENERATOR PLL 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:HiPerClockS™, PCI Express® (PCIe) 标准包装:1 系列:- 类型:时钟/频率发生器，多路复用器 PLL:是 主要目的:存储器，RDRAM 输入:晶体 输出:LVCMOS 电路数:1 比率 - 输入:输出:1:2 差分 - 输入:输出:无/是 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:Digi-Reel® 其它名称:296-6719-6 |
| ICS841S01BGLFT | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:PCI EXPRESS⑩ CLOCK GENERATOR |
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