参数资料
型号: ICS853058AGT
元件分类: 编、解码器及复用、解复用
英文描述: 853058 SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO24
封装: 4.40 X 7.80 MM, 0.92 MM HEIGHT, MS-153, TSSOP-24
文件页数: 5/17页
文件大小: 240K
代理商: ICS853058AGT
853058AG
www.icst.com/products/hiperclocks.html
REV. A APRIL 24, 2006
13
Integrated
Circuit
Systems, Inc.
ICS853058
8:1, DIFFERENTIAL-TO-
3.3V OR 2.5V LVPECL/ECL CLOCK MULTIPLEXER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS853058.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853058 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V ± 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 47mA = 162.86mW
Power (outputs)
MAX = 30.94mW
Total Power
_MAX (3.465V) = 162.86mW + 30.94mW = 193.8mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.194W * 65°C/W = 97.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Meters per Second)
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
24-PIN TSSOP FORCED CONVECTION
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65°C/W
62°C/W
相关PDF资料
PDF描述
ICS8530DY-01 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS8530DY-01LF 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS8530DY-01 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS8530DYI-01LFT 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
ICS8530DYI-01 8530 SERIES, LOW SKEW CLOCK DRIVER, 16 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP48
相关代理商/技术参数
参数描述
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