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| 型号： | ICS8745BYIT |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 8745 SERIES, PLL BASED CLOCK DRIVER, 5 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32 |
| 封装： | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 |
| 文件页数： | 7/20页 |
| 文件大小： | 1383K |
| 代理商： | ICS8745BYIT |
ICS8745BI
1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
IDT / ICS LVDS ZERO DELAY CLOCK GENERATOR
15
ICS8745BYIREV. C APRIL 16, 2007
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8745BI.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8745BI is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (128mA + 18mA) = 506mW
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 62mA = 215mW
Total Power_MAX = 506mW + 215mW = 721mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate
air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 7below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.721W * 42.1°C/W = 115.3°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7. Thermal Resitance θJA for 32 Lead LQFP, Forced Convection
θ
JA vs. Air Flow
Linear Feet per Minute
0200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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相关代理商/技术参数 |
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| ICS8745BYLF | 功能描述:IC CLK GEN 5LVDS 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:2,000 系列:- 类型:PLL 频率合成器 PLL:是 输入:晶体 输出:时钟 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/无 频率 - 最大:1GHz 除法器/乘法器:是/无 电源电压:4.5 V ~ 5.5 V 工作温度:-20°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-LSSOP（0.175"，4.40mm 宽） 供应商设备封装:16-SSOP 包装:带卷 (TR) 其它名称:NJW1504V-TE1-NDNJW1504V-TE1TR |
| ICS8745BYLFT | 功能描述:IC CLK GEN 1:5 DIFF-LVDS 32-LQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS874S02BMI | 制造商:Integrated Device Technology Inc 功能描述:IC CLK GENERATOR ZDB 20SOIC |
| ICS874S02BMILF | 功能描述:IC CLK GEN 1:1 DIFF ZD 20SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ICS874S02BMILFT | 功能描述:IC CLK GEN 1:1 DIFF ZD 20SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
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