参数资料
型号: IDT71V3556SA100BQ8
厂商: IDT, Integrated Device Technology Inc
文件页数: 9/28页
文件大小: 0K
描述: IC SRAM 4MBIT 100MHZ 165FBGA
标准包装: 2,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步 ZBT
存储容量: 4.5M(128K x 36)
速度: 100MHz
接口: 并联
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
封装/外壳: 165-TBGA
供应商设备封装: 165-CABGA(13x15)
包装: 带卷 (TR)
其它名称: 71V3556SA100BQ8
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with
ZBT ? Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Synchronous Truth Table
(1)
CEN
R/ W
Chip (5)
ADV/ LD
BW x
ADDRESS
PREVIOUS CYCLE
CURRENT CYCLE
I/O
Enable
USED
(2 cycles later)
L
L
L
L
L
L
H
L
H
X
X
X
X
X
Select
Select
X
X
Deselect
X
X
L
L
H
H
L
H
X
Valid
X
Valid
X
X
X
X
External
External
Internal
Internal
X
X
X
X
X
LOAD WRITE /
BURST WRITE
LOAD READ /
BURST READ
X
DESELECT / NOOP
X
LOAD WRITE
LOAD READ
BURST WRITE
(Advance burst counter) (2)
BURST READ
(Advance burst counter) (2)
DESELECT or STOP (3)
NOOP
SUSPEND (4)
D (7)
Q (7)
D (7)
Q (7)
HiZ
HiZ
Previous Value
NOTES:
5281 tbl 08
1. L = V IL , H = V IH , X = Don’t Care.
2. When ADV/ LD signal is sampled high, the internal burst counter is incremented. The R/ W signal is ignored when the counter is advanced. Therefore the nature of the burst
cycle (Read or Write) is determined by the status of the R/ W signal when the first address is loaded at the beginning of the burst cycle.
3. Deselect cycle is initiated when either ( CE 1 , or CE 2 is sampled high or CE 2 is sampled low) and ADV/ LD is sampled low at rising edge of clock. The data bus will tri-state
two cycles after deselect is initiated.
4. When CEN is sampled high at the rising edge of clock, that clock edge is blocked from propogating through the part. The state of all the internal registers and the I/Os remains
unchanged.
5. To select the chip requires CE 1 = L, CE 2 = L, CE 2 = H on these chip enables. Chip is deselected if any one of the chip enables is false.
6. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up.
7. Q - Data read from the device, D - data written to the device.
Partial Truth Table for Writes
(1)
READ
WRITE ALL BYTES
OPERATION
R/ W
H
L
BW 1
X
L
BW 2
X
L
BW 3 (3)
X
L
BW 4 (3)
X
L
WRITE BYTE 1 (I/O[0:7], I/O P1 )
(2)
L
L
H
H
H
WRITE BYTE 3 (I/O[16:23], I/O P3 )
WRITE BYTE 4 (I/O[24:31], I/O P4 )
WRITE BYTE 2 (I/O[8:15], I/O P2 ) (2)
(2,3)
(2,3)
NO WRITE
L
L
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
NOTES:
1. L = V IL , H = V IH , X = Don’t Care.
2. Multiple bytes may be selected during the same cycle.
3. N/A for X18 configuration.
9
6.42
5281 tbl 09
相关PDF资料
PDF描述
XC4008E-1PG191C IC FPGA C-TEMP 5V 1SPD 191-CPGA
IDT71V547S80PFG IC SRAM 4MBIT 80NS 100TQFP
XC4008E-1PC84C IC FPGA C-TEMP 5V 1SPD 84-PLCC
XC4006E-4TQ144I IC FPGA I-TEMP 5V 4SPD 144-TQFP
XC4006E-4PQ208I IC FPGA I-TEMP 5V 4SPD 208-PQFP
相关代理商/技术参数
参数描述
IDT71V3556SA100BQG 功能描述:IC SRAM 4MBIT 100MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V3556SA100BQG8 功能描述:IC SRAM 4MBIT 100MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
IDT71V3556SA100BQGI 功能描述:IC SRAM 4MBIT 100MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V3556SA100BQGI8 功能描述:IC SRAM 4MBIT 100MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
IDT71V3556SA100BQI 功能描述:IC SRAM 4MBIT 100MHZ 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)