参数资料
型号: IDT71V546S133PFG8
厂商: IDT, Integrated Device Technology Inc
文件页数: 14/21页
文件大小: 0K
描述: IC SRAM 4MBIT 133MHZ 100TQFP
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步 ZBT
存储容量: 4.5M(128K x 36)
速度: 133MHz
接口: 并联
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 带卷 (TR)
其它名称: 71V546S133PFG8
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with
ZBT ? Feature, Burst Counter and Pipelined Outputs
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(V DD = 3.3V +/-5%, Commercial and Industrial Temperature Ranges)
71V546S133
71V546S117
71V546S100
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Clock Parameters
t F
t CYC
(1)
t CH (2)
t CL (2)
Clock Cycle Time
Clock Frequency
Clock High Pulse Width
Clock Low Pulse Width
7.5
____
2.5
2.5
____
133
____
____
8.5
____
3
3
____
117
____
____
10
____
3.5
3.6
____
100
____
____
ns
MHz
ns
ns
Output Parameters
t OLZ
t CD
t CDC
t CLZ (3,4,5)
t CHZ (3,4,5)
t OE
(3,4)
t OHZ (3.4)
Clock High to Valid Data
Clock High to Data Change
Clock High to Output Active
Clock High to Data High-Z
Output Enable Access Time
Output Enable Low to Data Active
Output Enable High to Data High-Z
____
1.5
1.5
1.5
____
0
____
4.2
____
____
3.5
4.2
____
3.5
____
1.5
1.5
1.5
____
0
____
4.5
____
____
3.5
4.5
____
3.5
____
1.5
1.5
1.5
____
0
____
5
____
____
3.5
5
____
3.5
ns
ns
ns
ns
ns
ns
ns
Setup Times
t SE
t SA
t SD
t SW
t SADV
t SC
t SB
Clock Enable Setup Time
Address Setup Time
Data in Setup Time
Read/Write (R/W) Setup Time
Advance/Load (ADV/LD) Setup Time
Chip Enable/Select Setup Time
Byte Write Enable (BWx) Setup Time
2.0
2.0
1.7
2.0
2.0
2.0
2.0
____
____
____
____
____
____
____
2.0
2.0
1.7
2.0
2.0
2.0
2.0
____
____
____
____
____
____
____
2.2
2.2
2.0
2.2
2.2
2.2
2.2
____
____
____
____
____
____
____
ns
ns
ns
ns
ns
ns
ns
Hold Times
t HE
t HA
t HD
t HW
t HADV
t HC
t HB
Clock Enable Hold Time
Address Hold Time
Data in Hold Time
Read/Write (R/W) Hold Time
Advance/Load (ADV/LD) Hold Time
Chip Enable/Select Hold Time
Byte Write Enable (BWx) Hold Time
0.5
0.5
0.5
0.5
0.5
0.5
0.5
____
____
____
____
____
____
____
0.5
0.5
0.5
0.5
0.5
0.5
0.5
____
____
____
____
____
____
____
0.5
0.5
0.5
0.5
0.5
0.5
0.5
____
____
____
____
____
____
____
ns
ns
ns
ns
ns
ns
ns
NOTES:
3821 tbl 23
1. t F = 1/t CYC .
2. Measured as HIGH above 2.0V and LOW below 0.8V.
3. Transition is measured ±200mV from steady-state.
4. These parameters are guaranteed with the AC load (Figure 1) by device characterization. They are not production tested.
5. To avoid bus contention, the output buffers are designed such that t CHZ (device turn-off) is about 2 ns faster than t CLZ (device turn-on) at a given temperature and voltage.
The specs as shown do not imply bus contention because t CLZ is a Min. parameter that is worse case at totally different test conditions (0 deg. C, 3.465V) than t CHZ,
which is a Max. parameter (worse case at 70 deg. C, 3.135V).
14
相关PDF资料
PDF描述
HSC65DRYN CONN EDGECARD 130PS DIP .100 SLD
HSC65DRYH CONN EDGECARD 130PS DIP .100 SLD
IDT71V546S100PFG8 IC SRAM 4MBIT 100MHZ 100TQFP
ACB64DHAS CONN EDGECARD 128PS R/A .050 DIP
EMC65DRAS-S734 CONN EDGECARD 130PS .100 R/A PCB
相关代理商/技术参数
参数描述
IDT71V546S133PFGI 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V546S133PFGI8 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V546S133PFI 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V546S133PFI8 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V546XS100PFG 功能描述:IC SRAM 4MBIT 100MHZ 100TQFP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)