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参数资料
| 型号： | IDT72T3655L5BB |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 52/57页 |
| 文件大小： | 0K |
| 描述： | IC FIFO 2048X36 5NS 208-BGA |
| 标准包装： | 1 |
| 系列： | 72T |
| 功能： | 异步，同步 |
| 存储容量： | 72K（2K x 36） |
| 数据速率： | 83MHz |
| 访问时间： | 5ns |
| 电源电压： | 2.375 V ~ 2.625 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 208-BGA |
| 供应商设备封装： | 208-PBGA（17x17） |
| 包装： | 托盘 |
| 其它名称： | 72T3655L5BB |
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56
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync
36-BIT FIFO
1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
FEBRUARY 4, 2009
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72T3645 can easily be adapted to applications requiring depths
greater than 1,024, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665,
8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the
IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115
and 262,144 for the IDT72T36125 with an 18-bit bus width. In FWFT mode,
theFIFOscanbeconnectedinseries(thedataoutputsofoneFIFOconnected
to the data inputs of the next) with no external logic necessary. The resulting
configuration provides a total depth equivalent to the sum of the depths
associated with each single FIFO. Figure 37 shows a depth expansion using
two IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/
72T36105/72T36115/72T36125 devices.
CareshouldbetakentoselectFWFTmodeduringMasterResetforallFIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain – no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
datawordappearsattheoutputsofoneFIFO,thatdevice's
ORlinegoesLOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for
ORof
thelastFIFOinthechaintogoLOW(i.e.validdatatoappearonthelastFIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK
period. NotethatextracyclesshouldbeaddedforthepossibilitythatthetSKEW1
specificationisnotmetbetweenWCLKandtransferclock,orRCLKandtransfer
clock, for the
OR flag.
The"rippledown"delayisonlynoticeableforthefirstwordwrittentoanempty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configurationwill"bubbleup"fromthelastFIFOtothepreviousoneuntilitfinally
movesintothefirstFIFOofthechain. Eachtimeafreelocationiscreatedinone
FIFO of the chain, that FIFO's
IRlinegoesLOW,enablingtheprecedingFIFO
to write a word to fill it.
Forafullexpansionconfiguration,theamountoftimeittakesfor
IRofthefirst
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. NotethatextracyclesshouldbeaddedforthepossibilitythatthetSKEW1
specificationisnotmetbetweenRCLKandtransferclock,orWCLKandtransfer
clock, for the
IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
isfaster. Boththeseactionsresultindatamoving,asquicklyaspossible,tothe
end of the chain and free locations to the beginning of the chain.
Figure 37. Block Diagram of 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36, 262,144 x 36 and 524,288 x 36
Depth Expansion
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
5907 drw42
n
FWFT/SI
IDT
72T3645
72T3655
72T3665
72T3675
72T3685
72T3695
72T36105
72T36115
72T36125
RCS
READ CHIP SELECT
RCS
IDT
72T3645
72T3655
72T3665
72T3675
72T3685
72T3695
72T36105
72T36115
72T36125
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT72T3655L5BBI | 功能描述:IC FIFO 2048X36 5NS 208-BGA RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72T 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
| IDT72T3655L6-7BB | 功能描述:IC FIFO 2048X36 6-7NS 208-BGA RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72T 标准包装:90 系列:7200 功能:同步 存储容量:288K（16K x 18） 数据速率:100MHz 访问时间:10ns 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:64-LQFP 供应商设备封装:64-TQFP（14x14） 包装:托盘 其它名称:72271LA10PF |
| IDT72T3665L4-4BB | 功能描述:IC FIFO 4096X36 4-4NS 208-BGA RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72T 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
| IDT72T3665L4-4BBG | 功能描述:IC FIFO 4096X36 4-4NS 208-BGA RoHS:是 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72T 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
| IDT72T3665L5BB | 功能描述:IC FIFO 4096X36 5NS 208-BGA RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72T 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
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