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参数资料
| 型号： | IDT79RC32T332-100DHI |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 25/30页 |
| 文件大小： | 0K |
| 描述： | IC MPU 32BIT CORE 100MHZ 208-QFP |
| 产品变化通告： | Product Discontinuation 07/Dec/2009 |
| 标准包装： | 24 |
| 系列： | Interprise™ |
| 处理器类型： | RISC 32-位 |
| 速度： | 100MHz |
| 电压： | 2.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 208-BFQFP |
| 供应商设备封装： | 208-PQFP（28x28） |
| 包装： | 托盘 |
| 其它名称： | 79RC32T332-100DHI |
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May 4, 2004
IDT 79RC32332
Secondly, the RC32332 implements additional reporting signals
intended to simplify the task of system debugging when using a logic
analyzer. This product allows the logic analyzer to differentiate transac-
tions initiated by DMA from those initiated by the CPU and further allows
CPU transactions to be sorted into instruction fetches vs. data fetches.
Finally, the RC32332 implements a full boundary scan capability,
allowing board manufacturing diagnostics and debug.
Packaging
The RC32332 is packaged using a 208 Quad Flat Pack (QFP)
package.
Thermal Considerations
The RC32332 consumes less than 2.0 W peak power. The device is
guaranteed in an ambient temperature range of 0
° to +70° C for
commercial temperature devices; -40
° to +85° C for industrial tempera-
ture devices.
Revision History
November 15, 2000: Initial publication.
December 12, 2000: Changed Max values for cpu_masterclock
period in Table 5 and added footnote. In Table 1, added 2nd alternate
function for spi_mosi, spi_miso, spi_sck. In Table 11, added “2” in Alt
column for pins 186, 187, 188. In RC32332 Alternate Signal Functions
table, added pin names in Alt #2 column for pins 186, 187, 188.
January 4, 2001: In Table 6 under Interrupt Handling, changed
Tdoh9 to Thld13 and moved the values for Tsu9 from the Max to the Min
column.
February 23, 2001: In Table 1, changed alternate function for
uart_tx[0] from PIO[3] to PIO[1]. In Table 11, changed the number of
alternate pins for Pin 156 from 1 to 2. In Table 12, added PIO[7] to Alt #2
column for Pin 156 and changed PIO[3] to PIO[1] for Pin 207.
March 13, 2001: Changed upper ambient temperature for industrial
and commercial uses from +70
° C to +85° C.
June 7, 2001: In the Clock Parameters table, added footnote 3 to
output_clk category and added NA to Min and Max columns. In Figure 3
(Reset Specification), enhanced signal line for cpu_masterclk. In Local
System Interface section of AC Timing Characteristics table, changed
values in Min column for last category of signals (Tdoh3) from 1.5 to 2.5
for both speeds. In SDRAM Controller section of same table, changed
values in Min column for last category of signals (9 signals) from 1 to 2.5
for both speeds.
September 14, 2001: In the Reset category of Table 6: switched
mem_addr[19:17] from Tsu22 and Thld22 to Tsu10 and Thld10;
switched mem_addr[22:20] from Tsu10 and Thld10 to Tsu22 and
Thld22; moved ejtag_pcst[2:0] from Reset to Debug Interface category
under Tsu20 and Thld20.
November 1, 2001: Added Input Voltage Undershoot parameter and
2 footnotes to Table 10. Changed to DH package.
May 2, 2002: Changed from PCI 2.1 to 2.2 compliant. Added 512 MB
SDRAM support. Changed upper ambient temperature for commercial
uses back from +85
° C to +70° C (changed erroneously from 70 to 85
on March 13, 2001). Added Reset State Status column to Table 1.
Revised description of jtag_trst_n in Table 1 and changed this pin to a
pull-down instead of a pull-up.
July 3, 2002: This data sheet now describes revision Y silicon and is
no longer applicable to revision Z.
July 12, 2002: Added 150MHz speed grade. In Table 6: DMA
section, changed Thld9 Min values from 2 to 1; in PIO section, changed
Thld9 Min values from 2 to 1. Changed revision Y data sheet from
Preliminary to Final.
September 18, 2002: Added cpu_coldreset_n rise time to Table 5,
Clock Parameters. Added mem_addr[16] and sdram_addr[16] to Tables
1 and 12. Changed Logic Diagram to include sdram_addr[16].
December 18, 2002: In the Reset section of Table 6, AC Timing
Characteristics, setup and hold time categories for cpu_coldreset_n
have been deleted.
September 2, 2003: Added 2.5V version of device. Changed tables
to include 2.5V values where appropriate. Added a Power Consumption
table, Temperature and Voltage table, and Power Curves for the 2.5V
device. In the PCI category of Table 6, created separate sections for
3.3V and 2.5V devices and in 2.5V section changed time to 4 ns for
pci_cbe_n[3:0], pci_frame_n, pci_trdy_n, and pci_irdy_n. In Table 8,
added 3 new categories (Input Pads, PCI Input Pads, and All Pads) and
added footnotes 2 and 3. In Table 13, pins 181 and 184 were changed
from Vcc Core to Vcc I/O.
March 24, 2004: In Table 1, changed description in Satellite Mode
for pci_rst_n. Specified “cold” reset on pages 12 and 13. Changed
several values in Table 12, Absolute Maximum Ratings, and changed
footnote 1 to that table.
May 4, 2004: Revised values in Table 9, Power Consumption.
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相关代理商/技术参数 |
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| IDT79RC32T332-133DH | 功能描述:IC MPU 32BIT CORE 133MHZ 208-QFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32T332-133DHI | 功能描述:IC MPU 32BIT CORE 133MHZ 208-QFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32T332-150DH | 功能描述:IC MPU 32BIT CORE 1150MHZ 208-QF RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32T333-100DH | 功能描述:IC MPU 32BIT CORE 100MHZ 208-QFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| IDT79RC32T333-100DHI | 功能描述:IC MPU 32BIT CORE 100MHZ 208-QFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
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