参数资料
型号: IN74LV574N
厂商: INTEGRAL JOINT STOCK COMPANY
英文描述: Octal D-type flip-flop; positive edge-trigger (3-State)
中文描述: 八路D型触发器;上升沿触发(3态)
文件页数: 8/8页
文件大小: 194K
代理商: IN74LV574N
IN74LV574
8
INTEGRAL
Location of marking (mm):
left lower corner x=1.656, y=1.353.
Chip thickness:
0.46
±
0.02 mm, (0.35
±
0.02 mm – for SOIC).
PAD LOCATION
Location (left lower corner), mm
X
0.128
0.128
0.330
0.576
0.738
1.054
1.216
1.466
1.682
1.682
1.682
1.682
1.422
1.149
0.971
0.811
0.633
0.360
0.128
0.128
Pad No
Symbol
Y
Pad size, mm
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
Output enable
D 0
D 1
D 2
D 3
D 4
D 5
D 6
D 7
GND
Clock
Q 7
Q 6
Q 5
Q 4
Q 3
Q 2
Q 1
Q 0
V
CC
0.545
0.229
0.120
0.120
0.120
0.120
0.120
0.120
0.314
0.533
0.839
1.108
1.274
1.274
1.274
1.274
1.274
1.274
1.108
0.854
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
0.108 x 0.108
Note: Pad location is given as per metallization layer
01
10
02
X
Y
11
20
19
03
(0,0)
12
04
13
05
1.9 + 0.03
1
14
Chip marking
êáLV574
06
15
07
16
08
17
09
18
相关PDF资料
PDF描述
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