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| 型号： | IP4364CX8 |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 电路保护 |
| 英文描述： | Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 |
| 封装： | IP4064CX8/LF/P<NAX000|<<<1<Always Pb-free,;IP4064CX8/LF<NAX000|<<<1<Always Pb-free,;IP4064CX8/LF/S<NAX000|<<<1<Always Pb-free,;IP4364CX8/LF<NAX000|<& |
| 文件页数： | 10/14页 |
| 文件大小： | 267K |
| 代理商： | IP4364CX8 |
IP4064CX8_IP4364CX8_IP4366CX8_2
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 11 February 2010
10 of 14
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
Integrated SIM card passive filter array with ESD protection
For further information on temperature profiles, refer to application note
AN10365
“Surface mount reflow soldering description”
.
9.3.1
Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
9.3.2
Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
9.3.3
Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 9.
Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
相关PDF资料 |
PDF描述 |
|---|---|
| IP4366CX8 | Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 |
| IP4264CZ8-10-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-20-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-40-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-20 | Integrated USIM-SIM card passive filter arrays with ESD protection |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IP4364CX8/LF /T3 | 功能描述:多媒体杂项 INTEGRATED ESD RoHS:否 制造商:Texas Instruments 类型: 通道数量: 转换速率:540 Mbps 分辨率: 封装 / 箱体:SOIC-16 封装:Tube |
| IP4364CX8/LF,135 | 功能描述:ESD 抑制器 INTEGRATED ESD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4364CX8/LF/P | 制造商:NXP Semiconductors 功能描述:Tape & Reel 制造商:NXP Semiconductors 功能描述:EMI Filter 800MHz to 3000MHz Flat Style SMD |
| IP4364CX8/LF/P,135 | 功能描述:ESD 抑制器 Integrated SIM Card Passive Filter Array RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4365CX11 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4 |
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