参数资料
型号: IR3086AMPBF
厂商: International Rectifier
文件页数: 29/33页
文件大小: 0K
描述: IC PHASE CONTROLLER OVP 20MLPQ
标准包装: 100
系列: XPhase™
应用: 处理器
电流 - 电源: 10mA
电源电压: 8.4 V ~ 14 V
工作温度: 0°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-MLPQ
供应商设备封装: 20-MLPQ(4x4)
包装: 剪切带 (CT)
其它名称: *IR3086AMPBF
IR3086APbF
LAYOUT GUIDELINES
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout, therefore minimizing the noise coupled to the IC.
? Dedicate at least one middle layer for a ground plane, which is then split into signal ground plane (LGND) and
power ground plane (PGND).
? Connect PGND to LGND pins of each phase IC to the ground tab, which is tied to LGND and PGND planes
respectively through vias.
? In order to reduce the noise coupled to SCOMP pin of phase IC, use a dedicated wire to connect the capacitor
C SCOMP directly to LGND pin. However, connect PWM ramp capacitor C PWMRMP , phase delay programming
resistor R PHASE2 or R PHASE3, decoupling capacitor C VCC to LGND plane through vias.
? Place current sense resistors and capacitors (R CS+ , R CS- , C CS+ , and C CS- ) close to phase IC. Use Kelvin
connection for the inductor current sense wires, but separate the two wires by ground polygon. The wire from
the inductor terminal to RCS- should not cross over the fast transition nodes, i.e. switching nodes, gate drive
outputs and bootstrap nodes.
? Place the decoupling capacitors C VCC and C VCCL as close as possible to VCC and VCCL pins of the phase IC
respectively.
? Place the phase IC as close as possible to the MOSFETs to reduce the parasitic resistance and inductance of
the gate drive paths.
? Place the input ceramic capacitors close to the drain of top MOSFET and the source of bottom MOSFET. Use
combination of different packages of ceramic capacitors.
? There are two switching power loops. One loop includes the input capacitors, top MOSFET, inductor, output
capacitors and the load; another loop consists of bottom MOSFET, inductor, output capacitors and the load.
Route the switching power paths using wide and short traces or polygons; use multiple vias for connections
between layers.
LGND
To Signal Bus
PLANE
To VIN
To LGND
Plane
To LGND
Plane
To Gate
Drive
Voltage
SCOMP
EAIN
PWMRMP
LGND
BIASIN
DACIN
PHSFLT
CSIN-
To LGND
C VCC
VCC
CSIN+
Plane
To PGND
Plane
C VCCL
PGND
To Bottom To Top
MOSFET MOSFET
To
Ground
Polygon
Ground
Polygon
PLANE
Page 29 of 33
Switching
Node
To Inductor
May 13, 2009
相关PDF资料
PDF描述
IR3086MPBF IC CONTROLLER PHASE 20MLPQ
IR3087MPBF IC XPHASE W/OVP/TM CTRL 20MLPQ
IR3087M IC XPHASE W/OVP/TM CTRL 20-MLPQ
IR3088AMPBF IC XPHASE CONTROL 20L-MLPQ
IR3088AMTR IC XPHASE W/FAULT DET 20L-MLPQ
相关代理商/技术参数
参数描述
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