参数资料
型号: IR3086AMPBF
厂商: International Rectifier
文件页数: 31/33页
文件大小: 0K
描述: IC PHASE CONTROLLER OVP 20MLPQ
标准包装: 100
系列: XPhase™
应用: 处理器
电流 - 电源: 10mA
电源电压: 8.4 V ~ 14 V
工作温度: 0°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-MLPQ
供应商设备封装: 20-MLPQ(4x4)
包装: 剪切带 (CT)
其它名称: *IR3086AMPBF
IR3086APbF
Solder Resist
? The solder resist should be pulled away from the metal lead lands and center pad by a minimum of 0.06mm.
The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore, pulling the S/R 0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where the lead land
groups meet, it is recommended to provide a fillet so a solder resist width of ≥ 0.17mm remains.
? Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect
ratio of the solder resist strip separating the lead lands from the pad land.
? The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
diameter of the via.
Page 31 of 33
May 13, 2009
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参数描述
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