参数资料
型号: IR3505MPBF
厂商: International Rectifier
文件页数: 17/19页
文件大小: 0K
描述: IC XPHASE3 CONTROL 16-MLPQ
标准包装: 100
系列: XPhase3™
应用: 处理器
电流 - 电源: 3mA
电源电压: 8 V ~ 16 V
工作温度: 0°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-MLPQ
供应商设备封装: 16-MLPQ(3x3)
包装: 剪切带 (CT)
IR3505
Solder Resist
? The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The
solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm.
? At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide
a fillet so a solder resist width of ≥ 0.17mm remains.
? The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis-alignment.
In 0.5mm pitch cases it is
allowable to have the solder resist opening for the land pad to be smaller than the part pad.
? Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
? The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
Sept 26 , 2007
Page 17 of 19
th
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