参数资料
型号: IR3505MPBF
厂商: International Rectifier
文件页数: 18/19页
文件大小: 0K
描述: IC XPHASE3 CONTROL 16-MLPQ
标准包装: 100
系列: XPhase3™
应用: 处理器
电流 - 电源: 3mA
电源电压: 8 V ~ 16 V
工作温度: 0°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-MLPQ
供应商设备封装: 16-MLPQ(3x3)
包装: 剪切带 (CT)
IR3505
Stencil Design
? The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
? The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
land.
? The land pad aperture should be approximately 70% area of solder on the center pad. If too much
solder is deposited on the center pad the part will float and the lead lands will be open.
? The maximum length and width of the land pad stencil aperture should be equal to the solder resist
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
Sept 26 , 2007
Page 18 of 19
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