参数资料
型号: IRF7422D2TR
厂商: International Rectifier
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 20V 4.3A 8-SOIC
标准包装: 4,000
系列: FETKY™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 二极管(隔离式)
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 4.3A
开态Rds(最大)@ Id, Vgs @ 25° C: 90 毫欧 @ 2.2A,4.5V
Id 时的 Vgs(th)(最大): 700mV @ 250µA
闸电荷(Qg) @ Vgs: 22nC @ 4.5V
输入电容 (Ciss) @ Vds: 610pF @ 15V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
PD- 91412M
IRF7422D2
FETKY TM MOSFET & Schottky Diode
l
l
Co-packaged HEXFET ? Power
MOSFET and Schottky Diode
Ideal For Buck Regulator Applications
A
A
1
2
8
7
A
A
D
D
V DSS = -20V
l
l
l
l
P-Channel HEXFET
Low V F Schottky Rectifier
Generation 5 Technology
SO-8 Footprint
S
G
3
4
Top View
6
5
D
D
R DS(on) = 0.09 ?
Schottky Vf = 0.52V
Description
The FETKY TM family of Co-packaged HEXFETs and
Schottky diodes offer the designer an innovative
board space saving solution for switching regulator
and power management applications. Generation 5
HEXFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
Combinining this technology with International
Rectifier's low forward drop Schottky rectifiers results
in an extremely efficient device suitable for use in a
wide variety of portable electronics applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics. The
SO-8 package is designed for vapor phase, infrared or
wave soldering techniques.
Absolute Maximum Ratings
SO-8
Parameter
Maximum
Units
I D @ T A = 25°C
I D @ T A = 70°C
I DM
P D @T A = 25°C
P D @T A = 70°C
V GS
dv/dt
T J, T STG
Continuous Drain Current, V GS @ -4.5V
Pulsed Drain Current à
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt á
Junction and Storage Temperature Range
-4.3
-3.4
-33
2.0
1.3
16
± 12
-5.0
-55 to +150
A
W
mW/°C
V
V/ns
°C
Thermal Resistance Ratings
Parameter
Maximum
Units
R θ JA
Junction-to-Ambient ?
62.5
°C/W
Notes:
? Repetitive rating – pulse width limited by max. junction temperature (see fig. 11)
? I SD ≤ -2.2A, di/dt ≤ -50A/μs, V DD ≤ V (BR)DSS , T J ≤ 150°C
? Pulse width ≤ 300μs – duty cycle ≤ 2%
? Surface mounted on FR-4 board, t ≤ 10sec.
www.irf.com
1
10/18/04
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