参数资料
型号: IRF9410
厂商: International Rectifier
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 30V 7A 8-SOIC
标准包装: 95
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
开态Rds(最大)@ Id, Vgs @ 25° C: 30 毫欧 @ 7A,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 27nC @ 10V
输入电容 (Ciss) @ Vds: 550pF @ 25V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 管件
其它名称: *IRF9410
PD - 9.1562A
PRELIMINARY
IRF9410
HEXFET ? Power MOSFET
l
l
l
l
l
Generation V Technology
Ultra Low On-Resistance
N-Channel MOSFET
Surface Mount
Very Low Gate Charge and
Switching Losses
S
S
S
G
1
2
3
4
8
7
6
5
A
A
D
D
D
D
V DSS = 30V
R DS(on) = 0.030 ?
l
Fully Avalanche Rated
T o p V ie w
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
Recommended upgrade: IRF7403 or IRF7413
Lower profile/smaller equivalent: IRF7603
S O -8
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infra red, or wave soldering techniques.
Absolute Maximum Ratings ( T A = 25°C Unless Otherwise Noted)
Symbol
Maximum
Units
Drain-Source Voltage
Gate-Source Voltage
V DS
V GS
30
± 20
V
Continuous Drain Current ?
Pulsed Drain Current
T A = 25°C
T A = 70°C
I D
I DM
7.0
5.8
37
A
Continuous Source Current (Diode Conduction)
I S
2.8
Maximum Power Dissipation ?
Single Pulse Avalanche Energy ?
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ?
Junction and Storage Temperature Range
T A = 25°C
T A = 70°C
P D
E AS
I AR
E AR
dv/dt
T J, T STG
2.5
1.6
70
4.2
0.25
5.0
-55 to + 150
W
mJ
A
mJ
V/ ns
°C
Thermal Resistance Ratings
Parameter
Maximum Junction-to-Ambient ?
Symbol
R θ JA
Limit
50
Units
°C/W
9/15/97
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