参数资料
型号: IRF9Z24STRLPBF
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET P-CH 60V 11A D2PAK
标准包装: 800
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 11A
开态Rds(最大)@ Id, Vgs @ 25° C: 280 毫欧 @ 6.6A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 19nC @ 10V
输入电容 (Ciss) @ Vds: 570pF @ 25V
功率 - 最大: 3.7W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
IRF9Z24S, SiHF9Z24S, IRF9Z24L, SiHF9Z24L
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
FEATURES
? Halogen-free According to IEC 61249-2-21
V DS (V)
R DS(on) ( ? )
V GS = - 10 V
- 60
0.28
Definition
? Advanced Process Technology
? Surface Mount (IRF9Z24S, SiHF9Z24S)
Q g (Max.) (nC)
Q gs (nC)
Q gd (nC)
Configuration
19
5.4
11
Single
S
? Low-Profile Through-Hole (IRF9Z24L, SiHF9Z24L)
? 175 °C Operating Temperature
? Fast Switching
? P-Channel
? Fully Avalanche Rated
? Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay utilize
I 2 PAK (TO-262)
D 2 PAK (TO-263)
G
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
G
D
S
G
D
S
D
P-Channel MOSFET
with an extremely efficient and reliable device for use in a
wide variety of applications.
The D 2 PAK is a surface mount power package capable of
accommodating die size up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D 2 PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application.
The through-hole version (IR9Z24L, SiH9Z24L) is available
for low-profile applications.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
D 2 PAK (TO-263)
SiHF9Z24S-GE3
IRF9Z24SPbF
SiHF9Z24S-E3
D 2 PAK (TO-263)
SiHF9Z24STRL-GE3 a
IRF9Z24STRLPbF a
SiHF9Z24STL-E3 a
D 2 PAK (TO-263)
SiHF9Z24STRR-GE3 a
IRF9Z24STRRPbF a
SiHF9Z24STR-E3 a
I 2 PAK (TO-262)
-
IRF9Z24LPbF
SiHF9Z24L-E3
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (T C = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
V DS
V GS
LIMIT
- 60
± 20
UNIT
V
Continuous Drain Current e
Current a, e
Pulsed Drain
V GS at - 10 V
T C = 25 °C
T C = 100 °C
I D
I DM
- 11
- 7.7
- 44
A
Linear Derating Factor
0.40
W/°C
Single Pulse Avalanche Energy b, e
Repetitive Avalanche Current a
Repetitive Avalanche Energy a
E AS
I AR
E AR
240
- 11
6.0
mJ
A
mJ
Maximum Power Dissipation
T A = 25 °C
T C = 25 °C
P D
3.7
60
W
W
Peak Diode Recovery
dV/dt c, e
dV/dt
- 4.5
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) for 10 s
T J , T stg
- 55 to + 175
300 d
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V DD = - 25 V, starting T J = 25 °C, L = 2.3 mH, R g = 25 ? , I AS = - 11 A (see fig. 12).
c. I SD ? - 11 A, dI/dt ? 140 A/μs, V DD ? V DS , T J ? 175 °C.
d. 1.6 mm from case.
e. Uses IRF9Z24, SiHF9Z24 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91091
S11-1063-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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