参数资料
型号: IRFR3412TRRPBF
厂商: International Rectifier
文件页数: 2/11页
文件大小: 0K
描述: MOSFET N-CH 100V 48A DPAK
标准包装: 3,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 48A
开态Rds(最大)@ Id, Vgs @ 25° C: 25 毫欧 @ 29A,10V
Id 时的 Vgs(th)(最大): 5.5V @ 250µA
闸电荷(Qg) @ Vgs: 89nC @ 10V
输入电容 (Ciss) @ Vds: 3430pF @ 25V
功率 - 最大: 140W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
IRFR/U3412PbF
Static @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
100
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J Breakdown Voltage Temp. Coefficient
–––
0.10
––– V/°C Reference to 25°C, I D = 1mA ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.025
?
V GS = 10V, I D = 29A
?
V GS(th)
I DSS
I GSS
Gate Threshold Voltage
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
3.5
–––
–––
–––
–––
–––
–––
–––
–––
–––
5.5 V V DS = V GS , I D = 250μA
1.0 V DS = 95V, V GS = 0V
μA
250 V DS = 80V, V GS = 0V, T J = 150°C
100 V GS = 20V
nA
-100 V GS = -20V
Dynamic @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
––– I D = 29A
g fs
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
25
–––
–––
–––
–––
–––
–––
–––
59
21
17
19
68
44
––– S V DS = 50V, I D = 29A
89 I D = 29A
32 nC V DS = 50V
26 V GS = 10V, ?
––– V DD = 50V
ns
––– R G = 6.8 ?
t f
Fall Time
–––
37
––– V GS = 10V
?
C iss
C oss
C rss
C oss
C oss
C oss eff.
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
–––
–––
–––
–––
–––
–––
3430
270
150
1040
170
270
––– V GS = 0V
––– V DS = 25V
––– pF ? = 1.0MHz
––– V GS = 0V, V DS = 1.0V, ? = 1.0MHz
––– V GS = 0V, V DS = 80V, ? = 1.0MHz
––– V GS = 0V, V DS = 0V to 80V ?
Avalanche Characteristics
Parameter
Typ.
Max.
Units
E AS
I AR
E AR
Single Pulse Avalanche Energy ?
Avalanche Current ?
Repetitive Avalanche Energy ?
–––
–––
–––
160
29
14
mJ
A
mJ
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
Junction-to-Case
–––
1.05
R θ JA
R θ JA
Junction-to-Ambient (PCB mount)*
Junction-to-Ambient
–––
–––
50
110
°C/W
Notes:
? Repetitive rating; pulse width limited by
max. junction temperature. (See Fig. 11)
? Starting T J = 25°C, L = 0.38mH, R G = 25 ? ,
I AS = 29A, (See Figure 12a)
? I SD ≤ 29A, di/dt ≤ 420A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 150°C
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? C oss eff. is a fixed capacitance that gives the same charging time
as C oss while V DS is rising from 0 to 80% V DSS
? Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 30A.
* When mounted on 1" square PCB (FR-4 or G-10 Material) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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