参数资料
| 型号： | ISL1209IU10Z |
| 厂商： | Intersil |
| 文件页数： | 19/24页 |
| 文件大小： | 0K |
| 描述： | IC RTC LP BATT BACK SRAM 10MSOP |
| 标准包装： | 80 |
| 类型： | 时间事件记录器 |
| 特点： | 警报器，闰年，SRAM |
| 存储容量： | 2B |
| 时间格式： | HH:MM:SS（12/24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 电压 - 电源，电池： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
| 产品目录页面： | 1245 (CN2011-ZH PDF) |
4
FN6109.4
October 17, 2006
I2C Interface Specifications
Test Conditions:VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(Note 4)
MAX
UNITS
VIL
SDA and SCL input buffer LOW
voltage
-0.3
0.3 x
VDD
V
VIH
SDA and SCL input buffer HIGH
voltage
0.7 x
VDD
VDD +
0.3
V
Hysteresis
SDA and SCL input buffer hysteresis
0.05 x
VDD
V
VOL
SDA output buffer LOW voltage,
sinking 3mA
VDD = 5V, IOL = 3mA
0.4
V
Cpin
SDA and SCL pin capacitance
TA = +25°C, f = 1MHz, VDD =5V, VIN =0V,
VOUT =0V
10
pF
fSCL
SCL frequency
400
kHz
tIN
Pulse width suppression time at SDA
and SCL inputs
Any pulse narrower than the max spec is
suppressed.
50
ns
tAA
SCL falling edge to SDA output data
valid
SCL falling edge crossing 30% of VDD, until SDA
exits the 30% to 70% of VDD window.
900
ns
tBUF
Time the bus must be free before the
start of a new transmission
SDA crossing 70% of VDD during a STOP
condition, to SDA crossing 70% of VDD during
the following START condition.
1300
ns
tLOW
Clock LOW time
Measured at the 30% of VDD crossing.
1300
ns
tHIGH
Clock HIGH time
Measured at the 70% of VDD crossing.
600
ns
tSU:STA
START condition setup time
SCL rising edge to SDA falling edge. Both
crossing 70% of VDD.
600
ns
tHD:STA
START condition hold time
From SDA falling edge crossing 30% of VDD to
SCL falling edge crossing 70% of VDD.
600
ns
tSU:DAT
Input data setup time
From SDA exiting the 30% to 70% of VDD
window, to SCL rising edge crossing 30% of
VDD.
100
ns
tHD:DAT
Input data hold time
From SCL falling edge crossing 30% of VDD to
SDA entering the 30% to 70% of VDD window.
20
900
ns
tSU:STO
STOP condition setup time
From SCL rising edge crossing 70% of VDD, to
SDA rising edge crossing 30% of VDD.
600
ns
tHD:STO
STOP condition hold time
From SDA rising edge to SCL falling edge. Both
crossing 70% of VDD.
600
ns
tDH
Output data hold time
From SCL falling edge crossing 30% of VDD,
until SDA enters the 30% to 70% of VDD window.
0ns
tR
SDA and SCL rise time
From 30% to 70% of VDD.
20 +
0.1 x Cb
300
ns
tF
SDA and SCL fall time
From 70% to 30% of VDD.
20 +
0.1 x Cb
300
ns
Cb
Capacitive loading of SDA or SCL
Total on-chip and off-chip
10
400
pF
Rpu
SDA and SCL bus pull-up resistor
off-chip
Maximum is determined by tR and tF.
For Cb = 400pF, max is about 2~2.5k
.
For Cb = 40pF, max is about 15~20k
1k
NOTES:
1. IRQ & FOUT and EVDET Inactive.
2. LPMODE = 0 (default).
3. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
4. Typical values are for T = +25°C and 3.3V supply voltage.
5. VSUP = VDD if in VDD Mode, VSUP=VBAT if in VBAT Mode.
ISL1209
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