参数资料
型号: ISL55143IRZ-T
厂商: Intersil
文件页数: 9/14页
文件大小: 0K
描述: IC COMP CMOS HS 18V 36-TQFN
标准包装: 4,000
类型: 窗口
元件数: 4
电压 - 电源,单路/双路(±): 10 V ~ 18 V
电压 - 输入偏移(最小值): 50mV @ -3V,12V
电流 - 输入偏压(最小值): 0.025µA @ -3V,12V
电流 - 静态(最大值): 12.5mA
传输延迟(最大): 15ns
工作温度: -40°C ~ 85°C
封装/外壳: 36-WFQFN 裸露焊盘
安装类型: 表面贴装
包装: 带卷 (TR)
4
FN6230.3
April 4, 2013
Absolute Maximum Ratings
Thermal Information
VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 19V
Input Voltages
PD, CVAX, CVBX, VINPX, VOH, VOL
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VEE -0.5V) to (VCC +0.5V)
Output Voltage
QAX, QBX . . . . . . . . . . . . . . . . . . . . . (VOL -0.5V) to (VOH +0.5V)
Thermal Resistance (Typical, Note 8)
θJA (°C/W) θJC (°C/W)
16 Ld QFN Package (Notes 6, 7). . . . .
40
3
14 Ld TSSOP Package (Notes 4, 5) . .
100
31
20 Ld QFN Package (Notes 6, 7). . . . .
31
1.4
20 Ld TSSOP Package (Notes 4, 5) . .
76
25
36 Ld TQFN Package (Notes 6, 7). . . .
29
0.75
Maximum Junction Temperature (Plastic Plackage) . .
150°
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For
θJC, the “case temp” location is taken at the package top center.
6.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
7. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
8. Device temperature is closely tied to data-rates, driver loads and overall pin activity. Review “Power Dissipation Considerations” on page 6 for
more information.
Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Device Power
VCC-VEE
10
15
18
V
Comparator Output High Rail
VOH
VEE+1
VCC-0.5
V
Comparator Output Low Rail
VOL
VEE+0.5
VEE+6
V
Common Mode Input Voltage Range
VCM
VEE
VCC-5
V
Ambient Temperature
TA
-40
27
+85
°C
Junction Temperature
TJ
+125
°C
Electrical Specifications
Test Conditions: VCC = 12V, VEE = -3V, VOH = 5V, VOL = 0V, PD = VEE, CLOAD = 15pF, TA = 25°C, unless
otherwise specified.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
(Note 13)
TYP
MAX
(Note 13)
UNITS
DC CHARACTERISTICS
Input Offset Voltage
VOS
CVAX = CVBX = 1.5V
-50
50
mV
Input Bias Current
IBIAS
VINPX - CV(A/B)X = ±5V
10
25
nA
Power-down Current
IPD
PD = VCC
825
A
Power-down Time (Note 11)
tPD
10
s
Power-up Time (Note 11)
tPU
15
s
TIMING CHARACTERISTICS
Propagation Delay
tpd
4.0
9.5
15
ns
Rise Time (Note 11)
tr
1.4
ns
Fall Time (Note 11)
tf
1.5
ns
Propagation Delay Mismatch
Δtpd
0.5
2
ns
Maximum Operating Frequency
FMAXR
Symmetry 50%
65
MHz
Min Pulse Width
tWIDR
7.7
ns
COMPARATOR INPUT
Input Current
IIN
VINPX = VCC or VEE
-100
0
100
nA
ISL55141, ISL55142, ISL55143
相关PDF资料
PDF描述
LTC1417CGN#PBF IC A/D CONV 14BIT SAMPLNG 16SSOP
VE-J7Y-MY-F4 CONVERTER MOD DC/DC 3.3V 33W
78Q2123R/F TXRX 10/100 MDIX 3.3V COMM 32QFN
VE-J7Y-MY-F2 CONVERTER MOD DC/DC 3.3V 33W
NE521DR2G IC COMPARATOR DUAL DIFF 14-SOIC
相关代理商/技术参数
参数描述
ISL55162 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:SOC Dual Channel 300MHz Pin Electronics/DAC/PMU/Deskew
ISL55164 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:SOC Dual Channel 133MHz Pin Electronics Solution 3.75ns Minimum Pulse Width
ISL55164CNEZ 制造商:Intersil Corporation 功能描述:
ISL55187CRZ 制造商:Intersil Corporation 功能描述:ISL55187CRZ PB-FREE SOC PIN ELECTRONICS COMPANION PMU/DAC/RE - Trays
ISL55190 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Single and Dual Ultra-Low Noise, Ultra-Low Distortion, Low Power Op Amp