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| 型号： | ISL6307BCRZ-T |
| 厂商： | Intersil |
| 文件页数： | 26/33页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 48-QFN |
| 标准包装： | 4,000 |
| PWM 型： | 电压模式 |
| 输出数： | 6 |
| 频率 - 最大： | 275kHz |
| 占空比： | 66.7% |
| 电源电压： | 4.75 V ~ 5.25 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 48-VFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
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ISL6307B
ISL6307B multiplexes the TCOMP factor N with the TM
digital signal to obtain the adjustment gain to compensate
the temperature impact on the sensed channel current. The
compensated channel current signal is used for droop and
overcurrent protection functions.
Design Procedure:
1. Properly choose the voltage divider for TM pin to match
the TM voltage Vs temperature curve with the
recommended curve in Figure 16.
2. Run the actual board under the full load and the desired
cooling condition.
3. After the board reaches the thermal steady state, record
the temperature (T CSC ) of the current sense component
(inductor or MOSFET) and the voltage at TM and Vcc
pins.
4. Use the following equation to calculate the resistance of
the TM NTC, and find out the corresponding NTC
temperature T NTC from the NTC datasheet.
COMP
FB
IDROOP
o c
VDIFF
FIGURE 19. VOLTAGE AT IDROOP PIN WITH A RESISTOR
PLACED FROM IDROOP PIN TO GND WHEN
LOAD CURRENT CHANGES
The sensed current will flow out of IDROOP pin and develop
) = --------------------------------
R NTC ( T
NTC
V TM xR TM1
V CC – V TM
(EQ. 21)
the droop voltage across the resistor (R FB ) between FB and
VDIFF pins. If RFB resistance reduces as the temperature
increases, the temperature impact on the droop can be
209x ( T CSC – T
)
(EQ. 22)
N = -------------------------------------------------------- + 4
5. Use the following equation to calculate the TCOMP factor
N:
NTC
3xT NTC + 400
6. Choose an integral number close to the above result for
the TCOMP factor. If this factor is higher than 15, use
N=15. If it is less than 1, use N = 1.
7. Choose the pull-up resistor R TC1 (typical 10k ? ).
8. If N = 15, do not need the pull-down resistor R TC2 ,
otherwise obtain R TC2 by the following equation:
compensated. A NTC resistor can be placed close to the
power stage and used to form R FB . Due to the non-linear
temperature characteristics of the NTC, a resistor network is
needed to make the equivalent resistance between FB and
VDIFF pin is reverse proportional to the temperature.
The external temperature compensation network can only
compensate the temperature impact on the droop, while it
has no impact to the sensed current inside ISL6307B.
Therefore this network cannot compensate for the
temperature impact on the overcurrent protection function.
NxR TC1
R TC2 = -----------------------
15 – N
(EQ. 23)
General Design Guide
9. Run the actual board under full load again with the proper
resistors to TCOMP pin.
10. Record the output voltage as V1 immediately after the
output voltage is stable with the full load; Record the
output voltage as V2 after the VR reaches the thermal
steady state.
11. If the output voltage increases over 2mV as the
temperature increases, i.e. V2-V1 > 2mV, reduce N and
redesign R TC2 ; if the output voltage decreases over 2mV
as the temperature increases, i.e. V1-V2 > 2mV, increase
N and redesign R TC2 .
The design spreadsheet is available for those calculations.
External Temperature Compensation
By setting the voltage of TCOMP pin to 0, the integrated
temperature compensation function is disabled. And one
external temperature compensation network, shown in
Figure 18, can be used to cancel the temperature impact on
the droop (i.e. load line).
26
This design guide is intended to provide a high-level
explanation of the steps necessary to create a multiphase
power converter. It is assumed that the reader is familiar with
many of the basic skills and techniques referenced below. In
addition to this guide, Intersil provides complete reference
designs that include schematics, bills of materials, and
example board layouts for all common microprocessor
applications.
Power Stages
The first step in designing a multiphase converter is to
determine the number of phases. This determination
depends heavily on the cost analysis which in turn depends
on system constraints that differ from one design to the next.
Principally, the designer will be concerned with whether
components can be mounted on both sides of the circuit
board; whether through-hole components are permitted; and
the total board space available for power-supply circuitry.
Generally speaking, the most economical solutions are
those in which each phase handles between 15 and 20A. All
surface-mount designs will tend toward the lower end of this
current range. If through-hole MOSFETs and inductors can
FN9225.0
March 9, 2006
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相关代理商/技术参数 |
参数描述 |
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| ISL6307BIRZ | 功能描述:软开关 PWM 控制器 W/ANNEAL 6-PHS VR11 CNTRLR INDUSTRIAL RoHS:否 制造商:Fairchild Semiconductor 输出端数量: 输出电流: 开关频率: 工作电源电压:30 V 电源电流: 最大工作温度:+ 105 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel |
| ISL6307BIRZ-T | 功能描述:软开关 PWM 控制器 W/ANNEAL 6-PHS VR11 CNTRLR INDUSTRIAL RoHS:否 制造商:Fairchild Semiconductor 输出端数量: 输出电流: 开关频率: 工作电源电压:30 V 电源电流: 最大工作温度:+ 105 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel |
| ISL6307CRZ | 功能描述:IC REG CTRLR BUCK PWM VM 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| ISL6307CRZ-T | 功能描述:IC REG CTRLR BUCK PWM VM 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| ISL6307IRZ | 功能描述:IC REG CTRLR BUCK PWM VM 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
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