参数资料
型号: ISL6504CBZ-T
厂商: Intersil
文件页数: 15/16页
文件大小: 0K
描述: IC PWR SUPPLY CTRLR/MONTR 16SOIC
标准包装: 1,000
应用: 电源控制器/监控器
电源电压: 4.75 V ~ 5.25 V
电流 - 电源: 17mA
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 带卷 (TR)
ISL6504, ISL6504A
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L20.6x6
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VJJB ISSUE C)
MILLIMETERS
SYMBOL
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
k
L
L1
N
Nd
Ne
P
θ
MIN
0.80
-
-
0.28
3.55
3.55
0.25
0.35
-
-
-
NOMINAL
0.90
-
-
0.20 REF
0.33
6.00 BSC
5.75 BSC
3.70
6.00 BSC
5.75 BSC
3.70
0.80 BSC
-
0.60
-
20
5
5
-
-
MAX
1.00
0.05
1.00
0.40
3.85
3.85
-
0.75
0.15
0.60
12
NOTES
-
-
9
9
5, 8
-
9
7, 8
-
9
7, 8
-
-
8
10
2
3
3
9
9
Rev. 1 10/02
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
15
FN9062.2
April 13, 2004
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