参数资料
型号: ISL6532AIRZ-T
厂商: Intersil
文件页数: 15/17页
文件大小: 0K
描述: IC REG/CTRLR ACPI DUAL DDR 28QFN
标准包装: 4,000
应用: 存储器,DDR/DDR2 稳压器
电流 - 电源: 5.25mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-VQFN 裸露焊盘
供应商设备封装: 28-QFN(6x6)
包装: 带卷 (TR)
ISL6532A
Increasing the value of inductance reduces the ripple current
and voltage. However, the large inductance values reduce
the converter’s response time to a load transient.
One of the parameters limiting the converter’s response to a
load transient is the time required to change the inductor
current. Given a sufficiently fast control loop design, the
ISL6532A will provide either 0% or 100% duty cycle in
response to a load transient. The response time is the time
required to slew the inductor current from an initial current
value to the transient current level. During this interval the
difference between the inductor current and the transient
current level must be supplied by the output capacitor.
Minimizing the response time can minimize the output
capacitance required.
The response time to a transient is different for the
application of load and the removal of load. The following
equations give the approximate response time interval for
application and removal of a transient load:
For a through hole design, several electrolytic capacitors
may be needed. For surface mount designs, solid tantalum
capacitors can be used, but caution must be exercised with
regard to the capacitor surge current rating. These
capacitors must be capable of handling the surge-current at
power-up. Some capacitor series available from reputable
manufacturers are surge current tested.
MOSFET Selection - PWM Buck Converter
The ISL6532A requires 2 N-Channel power MOSFETs for
switching power and a third MOSFET to block backfeed from
V DDQ to the Input in S3 Mode. These should be selected
based upon r DS(ON) , gate supply requirements, and thermal
management requirements.
In high-current applications, the MOSFET power dissipation,
package selection and heatsink are the dominant design
factors. The power dissipation includes two loss
components; conduction loss and switching loss. The
conduction losses are the largest component of power
t RISE =
L x I TRAN
V IN - V OUT
t FALL =
L x I TRAN
V OUT
(EQ. 10)
dissipation for both the upper and the lower MOSFETs.
These losses are distributed between the two MOSFETs
according to duty factor. The switching losses seen when
P UPPER = Io × r DS ( ON ) × D + --- ? Io × V IN × t SW × f s
P LOWER = Io × r DS ( ON ) × ( 1 - D ) + --- ? Io × V IN × t SW × f s
-------------- × ? I OUT
+ ------ × ? ----------------------------- × -------------- ? ?
I RMS
?
V IN ? ?
?
L × f s
V IN
where: I TRAN is the transient load current step, t RISE is the
response time to the application of load, and t FALL is the
response time to the removal of load. The worst case
response time can be either at the application or removal of
load. Be sure to check both of these equations at the
minimum and maximum output levels for the worst case
response time.
Input Capacitor Selection - PWM Buck Converter
Use a mix of input bypass capacitors to control the voltage
overshoot across the MOSFETs. Use small ceramic
capacitors for high frequency decoupling and bulk capacitors
to supply the current needed each time the upper MOSFET
turns on. Place the small ceramic capacitors physically close
to the MOSFETs and between the drain of upper MOSFET
and the source of lower MOSFET.
The important parameters for the bulk input capacitance are
the voltage rating and the RMS current rating. For reliable
operation, select bulk capacitors with voltage and current
ratings above the maximum input voltage and largest RMS
current required by the circuit. Their voltage rating should be
at least 1.25 times greater than the maximum input voltage,
while a voltage rating of 1.5 times is a conservative
guideline. For most cases, the RMS current rating
requirement for the input capacitor of a buck regulator is
approximately 1/2 the DC load current.
The maximum RMS current required by the regulator may be
closely approximated through Equation 11:
V OUT 2 1 V IN - V OUT V OUT 2
=
MAX MAX 12
(EQ. 11)
15
sourcing current will be different from the switching losses
seen when sinking current. When sourcing current, the
upper MOSFET realizes most of the switching losses. The
lower switch realizes most of the switching losses when the
converter is sinking current (see the following equations).
These equations assume linear voltage-current transitions
and do not adequately model power loss due the reverse-
recovery of the upper and lower MOSFET’s body diode. The
gate-charge losses are dissipated in part by the ISL6532A
and do not significantly heat the MOSFETs. However, large
gate-charge increases the switching interval, t SW which
increases the MOSFET switching losses. Ensure that both
MOSFETs are within their maximum junction temperature at
high ambient temperature by calculating the temperature
rise according to package thermal-resistance specifications.
A separate heatsink may be necessary depending upon
MOSFET power, package type, ambient temperature and air
flow.
Approximate Losses while Sourcing current
2 1
2
P LOWER = Io 2 x r DS(ON) x (1 - D)
Approximate Losses while Sinking current
P UPPER = Io 2 x r DS(ON) x D
2 1
2
Where: D is the duty cycle = V OUT / V IN ,
t SW is the combined switch ON and OFF time, and
f s is the switching frequency.
(EQ. 12)
相关PDF资料
PDF描述
1SMA5927BT3 DIODE ZENER 12V 1.5W SMA
ISL6537CRZA-TR5160 IC REG/CTRLR ACPI DUAL DDR 28QFN
5-848407-2 LGH 1/2 SGL END LEAD ASY GRN
TC649BEPA IC PWM FAN SPEED CTRLR SD 8-DIP
ISL6537CRZ-TR5160 IC REG/CTRLR ACPI DUAL DDR 28QFN
相关代理商/技术参数
参数描述
ISL6532BCR 功能描述:IC REG/CTRLR ACPI DUAL DDR 20QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像,声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP(8x8) 包装:管件
ISL6532BCR-T 功能描述:IC REG/CTRLR ACPI DUAL DDR 20QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像,声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP(8x8) 包装:管件
ISL6532BCRZ 功能描述:电压模式 PWM 控制器 DL DDRG W/3ALDO FOR SPRINGDALE MBS 20 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
ISL6532BCRZ-T 功能描述:电压模式 PWM 控制器 DL DDRG W/3ALDO FOR SPRINGDALE MBS 20 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
ISL6532CCR 功能描述:IC REG/CTRLR ACPI DUAL DDR 28QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像,声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP(8x8) 包装:管件