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| 型号： | ISL6559CB |
| 厂商： | Intersil |
| 文件页数： | 19/21页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 28-SOIC |
| 标准包装： | 26 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 4MHz |
| 占空比： | 75% |
| 电源电压： | 4.75 V ~ 5.25 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
ISL6559
MULTIPHASE RMS IMPROVEMENT
Figure 18 is provided as a reference to demonstrate the
dramatic reductions in input-capacitor RMS current upon the
implementation of the multiphase topology. For example,
compare the input rms current requirements of a two-phase
converter versus that of a single phase. Assume both
converters have a duty cycle of 0.25, maximum sustained
output current of 40A, and a ratio of I C,PP to I O of 0.5. The
single phase converter would require 17.3 Arms current
capacity while the two-phase converter would only require 10.9
Arms. The advantages become even more pronounced when
output current is increased and additional phases are added to
keep the component cost down relative to the single phase
approach.
0.6
0.4
0.2
I C,PP = 0
I C,PP = 0.5 I O
I C,PP = 0.75 I O
0
0 0.2 0.4 0.6 0.8 1.0
DUTY CYCLE (V IN / V O )
FIGURE 18. NORMALIZED INPUT-CAPACITOR RMS CURRENT
VS DUTY CYCLE FOR SINGLE-PHASE
CONVERTER
Layout Considerations
The following multi-layer printed circuit board layout strategies
minimize the impact of board parasitics on converter
performance. The following sections highlight some important
practices which should not be overlooked during the layout
process.
Component Placement
Within the allotted implementation area, orient the switching
components first. The switching components are the most
critical because they switch large amounts of energy and
tend to generate large amounts of noise. How the switching
components are placed should also take into account power
dissipation. Align the output inductors and MOSFETs such
that space between the components is minimized while
creating the PHASE plane. Place the Intersil HIP660X
drivers as close as possible to the MOSFETs they control to
reduce the parasitics due to trace length between critical
driver input and output signals. If possible, duplicate the
same placement of these components for each phase.
Next, place the input and output capacitors. Position one
high-frequency ceramic input capacitor next to each upper
19
MOSFET drain. Place the bulk input capacitors as close to
the upper MOSFET drains as dictated by the component
size and dimensions. Long distances between input
capacitors and MOSFET drains results in too much trace
inductance and a reduction in capacitor performance. Locate
the output capacitors between the inductors and the load,
while keeping them in close proximity around the
microprocessor socket.
The ISL6559 can be placed off to one side or centered
relative to the individual phase switching components.
Routing of sense lines and PWM signals will guide final
placement. Critical small signal components to place close
to the controller include the ISEN resistors, R T resistor,
feedback resistor, and compensation components.
Bypass capacitors for the ISL6559 and HIP660X driver bias
supplies must be placed next to their respective pins. Stray
trace parasitics will reduce their effectiveness.
Plane Allocation and Routing
Dedicate one solid layer, usually a middle layer, for a ground
plane. Make all critical component ground connections with
vias to this plane. Dedicate one additional layer for power
planes; breaking the plane up into smaller islands of
common voltage. Use the remaining layers for small signal
wiring.
Route PHASE planes of copper filled polygons on the top
and bottom once the switching component placement is set.
Size the trace width between the driver gate pins and the
MOFET gates to carry 1A of current. When routing
components in the switching path, use short wide traces to
reduce the associated parasitics.
FN9084.8
December 29, 2004
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL6559CB-T | 功能描述:IC REG CTRLR BUCK PWM VM 28-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
| ISL6559CBZ | 功能描述:电流型 PWM 控制器 2 TO 4 PHS BUCK CNTRLR 2 8LD RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL6559CBZ-T | 功能描述:电流型 PWM 控制器 2 TO 4 PHS BUCK CNTRLR 2 8LD RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL6559CR | 功能描述:IC REG CTRLR BUCK PWM VM 32-QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
| ISL6559CR-T | 功能描述:IC REG CTRLR BUCK PWM VM 32-QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
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