参数资料
| 型号： | ISL78200AVEZ |
| 厂商： | Intersil |
| 文件页数： | 20/22页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK BOOST SYNC 20HTSSOP |
| 标准包装： | 740 |
| 类型： | 降压（降压），升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 可调至 0.8V |
| 输入电压： | 3 V ~ 40 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 200kHz ~ 2.2MHz |
| 电流 - 输出： | 2.5A |
| 同步整流器： | 两者兼有 |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 包装： | 管件 |
| 供应商设备封装： | 20-HTSSOP |
ISL78200
it is under the acceptable range. Suggest to run the iSim model
simulation to select the proper inductor value.
Boost Output Capacitor
Based on the same theory in boost start-up described above in
boost inductor selection, a large capacitor at boost output will
cause high inrush current at boost PWM start-up. 22μF is a good
choice for applications with buck output voltage less than 10V.
Also, some minimum amount of capacitance has to be used in
boost output to keep the system stable. Suggest to run the iSim
model simulation to select the proper inductor value.
Layout Suggestions
1. Put the input ceramic capacitors as close to the IC VIN pin and
power ground connecting to the power MOSFET or diode.
Keep this loop (input ceramic capacitor, IC V IN pin and
MOSFET/diode) as tiny as possible to achieve the least
voltage spikes induced by the trace parasitic inductance.
2. Put the input aluminum capacitors close to IC VIN pin.
3. Keep the phase node copper area small but large enough to
handle the load current.
4. Put the output ceramic and aluminum capacitors also close
to the power stage components.
5. Put vias (20 recommended) in the bottom pad of the IC. The
bottom pad should be placed in the ground copper plane with
an area as large as possible in multiple layers to effectively
reduce the thermal impedance.
6. Place the 4.7μF ceramic decoupling capacitor at the VCC pin
and as close as possible to the IC. Put multiple vias ( ≥ 3) close
to the ground pad of this capacitor.
7. Keep the bootstrap capacitor close to the IC.
8. Keep the LGATE drive trace as short as possible and try to
avoid using a via in the LGATE drive path to achieve the lowest
impedance.
9. Place the positive voltage sense trace close to the load for
tighter regulation.
10. Place all the peripheral control components close to the IC.
.
FIGURE 35. PCB VIA PATTERN
20
FN7641.2
December 24, 2013
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PDF描述 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL78200AVEZ-T | 功能描述:IC REG BUCK BOOST SYNC 20HTSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:降压（降压） 输出类型:两者兼有 输出数:1 输出电压:5V，1 V ~ 10 V 输入电压:3.5 V ~ 28 V PWM 型:电流模式 频率 - 开关:220kHz ~ 1MHz 电流 - 输出:600mA 同步整流器:无 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SSOP（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:16-QSOP |
| ISL78201AVEZ-T | 制造商:Intersil Corporation 功能描述:2.5A SYNC BUCK W PRE-BOOST REG, 20LD HTSSOP 4.4MM, T&R - Tape and Reel |
| ISL78201AVEZ-TR5303 | 制造商:Intersil Corporation 功能描述: 制造商:Intersil Corporation 功能描述:HARMAN BECKER ISL78201AVEZ-T W/SPECIAL CHANGE CONTROL, 12 MO - Tape and Reel |
| ISL78205 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:2.5A Buck Controller with Integrated High-Side MOSFET |
| ISL78205AVEZ | 功能描述:IC REG BUCK SYNC ADJ 20HTSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:降压（降压） 输出类型:两者兼有 输出数:1 输出电压:5V，1 V ~ 10 V 输入电压:3.5 V ~ 28 V PWM 型:电流模式 频率 - 开关:220kHz ~ 1MHz 电流 - 输出:600mA 同步整流器:无 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SSOP（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:16-QSOP |
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