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| 型号： | ISL8105BCBZ |
| 厂商： | Intersil |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 8-SOIC |
| 标准包装： | 980 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 330kHz |
| 占空比： | 100% |
| 电源电压： | 6.5 V ~ 14.4 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 包装： | 管件 |
ISL8105B
Another consideration for high V IN is duty cycle. Very low
duty cycles (such as 20V in to 1.0V out, for 5% duty cycle)
require component selection compatible with that choice
(such as low r DS(ON) bottom-side MOSFET, and a good LC
output filter). At the other extreme (for example, 20V in to
ISL8105B
V IN
12V out), the top-side MOSFET needs to be low r DS(ON) . In
addition, if the duty cycle gets too high, it can affect the
overcurrent sample time. In all cases, the input and output
capacitors and both MOSFETs must be rated for the
voltages present.
TGATE
LX
BGATE
Q 1
Q 2
C IN
L O
C O
V OUT
+V IN
BOOT Refresh
In the event that the TGATE is on for an extended period of
time, the charge on the boot capacitor can start to sag,
raising the r DS(ON) of the top-side MOSFET. The ISL8105B
has a circuit that detects a long TGATE on-time (nominal
100μs), and forces the BGATE to go high for one clock
cycle, which will allow the boot capacitor some time to
recharge. Separately, the OCP circuit has a BGATE pulse
stretcher (to be sure the sample time is long enough), which
can also help refresh the boot. But if OCP is disabled (no
current sense resistor), the regular boot refresh circuit will
still be active.
Current Sinking
The ISL8105B incorporates a MOSFET shoot-through
protection method which allows a converter to sink current
as well as source current. Care should be exercised when
designing a converter with the ISL8105B when it is known
that the converter may sink current.
When the converter is sinking current, it is behaving as a
boost converter that is regulating its input voltage. This
means that the converter is boosting current into the V IN rail.
If there is nowhere for this current to go, such as to other
distributed loads on the V IN rail, through a voltage limiting
protection device, or other methods, the capacitance on the
PGND
RETURN
FIGURE 7. PRINTED CIRCUIT BOARD POWER AND
GROUND PLANES OR ISLANDS
Figure 7 shows the critical power components of the
converter. To minimize the voltage overshoot/undershoot,
the interconnecting wires indicated by heavy lines should be
part of ground or power plane in a printed circuit board. The
components shown in Figure 8 should be located as close
together as possible. Please note that the capacitors C IN
and C O each represent numerous physical capacitors.
Locate the ISL8105B within three inches of the MOSFETs,
Q 1 and Q 2 . The circuit traces for the MOSFETs’ gate and
source connections from the ISL8105B must be sized to
handle up to 1A peak current.
Proper grounding of the IC is important for correct operation
in noisy environments. The GND pin should be connected to
a large copper fill under the IC which is subsequently
connected to board ground at a quiet location on the board,
typically found at an input or output bulk (electrolytic)
capacitor.
BOOT
V IN bus will absorb the current. This situation will allow
voltage level of the V IN rail (also LX) to increase. If the
voltage level of the LX is increased to a level that exceeds
ISL8105B
C BOOT
LX
Q 1
L O
V OUT
the maximum voltage rating of the ISL8105B, then the IC will
experience an irreversible failure and the converter will no
longer be operational. Ensuring that there is a path for the
current to follow other than the capacitance on the rail will
prevent this failure mode.
+V BIAS
BGATE/BSOC
V BIAS
C VBIAS
GND GND
Q 2
C O
Application Guidelines
Layout Considerations
As in any high-frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
10
FIGURE 8. PRINTED CIRCUIT BOARD SMALL SIGNAL
LAYOUT GUIDELINES
Figure 8 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Locate the resistor,
R BSOC , close to the BGATE/BSOC pin as the internal BSOC
current source is only 21.5μA. Minimize the loop from any
pulldown transistor to reduce antenna effect. Provide local
decoupling between VBIAS and GND pins as described
FN6447.2
April 15, 2010
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相关代理商/技术参数 |
参数描述 |
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| ISL8105BCBZ-T | 功能描述:IC REG CTRLR BUCK PWM VM 8-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,500 系列:PowerWise® PWM 型:控制器 输出数:1 频率 - 最大:1MHz 占空比:95% 电源电压:2.8 V ~ 5.5 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:6-WDFN 裸露焊盘 包装:带卷 (TR) 配用:LM1771EVAL-ND - BOARD EVALUATION LM1771 其它名称:LM1771SSDX |
| ISL8105BCRZ | 功能描述:IC REG CTRLR BUCK PWM VM 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| ISL8105BCRZ-T | 功能描述:IC REG CTRLR BUCK PWM VM 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,500 系列:PowerWise® PWM 型:控制器 输出数:1 频率 - 最大:1MHz 占空比:95% 电源电压:2.8 V ~ 5.5 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:6-WDFN 裸露焊盘 包装:带卷 (TR) 配用:LM1771EVAL-ND - BOARD EVALUATION LM1771 其它名称:LM1771SSDX |
| ISL8105BEVAL1Z | 功能描述:EVAL BOARD ISL8105B RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
| ISL8105BEVAL2Z | 功能描述:EVALUATION BOARD FOR ISL8105B RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
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