参数资料
型号: ISL98003CNZ-EVALZ
厂商: Intersil
文件页数: 25/31页
文件大小: 0K
描述: EVAL BOARD FOR ISL98003CNZ
标准包装: 1
系列: *
31
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FN6760.0
September 12, 2008
ISL98003
Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
12° ALL AROUND
1
80
B
EXPOSED
PAD AREA
PIN 1
12° ALL AROUND
Y
PIN 1
BOTTOM VIEW
SIDE VIEW
TOP VIEW
E
E1
D
D1
9.500 REF
12.000±0.100
11.950±0.100
REF. 6.000
PLANE
SEATING
C
ddd
R0.250 TYP
cc
c
GAGE
PLANE
R0.080~0.200
ALL AROUND
0° MIN.
0.200 MIN.
R0
.08
0 MI
N.
0.250
L
C
A1
e
A
A2
b
L1
a
DETAIL "Y"
Q80.12x12
80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD
PACKAGE
SYMBOL
MILLIMETERS
REMARKS
MIN
TYP
MAX
A
-
1.20
Overall height
A1
0.05
0.10
0.15
Standoff
A2
0.90
1.00
1.10
Package thickness
D
13.8
14.0
14.2
Lead tip to tip
D1
11.9
12.0
12.1
Package length
E
13.8
14.0
14.2
Lead tip to tip
E1
11.9
12.0
12.1
Package width
L
0.45
0.60
0.75
Foot length
L1
1.000 REF.
Lead length
T
0.09
0.150
0.20
Lead thickness
T1
0.097
0.127
0.157
Lead base metal thickness
a
0°~7°
Foot angle
b
0.17
0.22
0.27
Lead width
b1
0.17
0.20
0.23
Lead base metal width
e
0.500 BASE
Lead pitch
ccc
-
0.080
-
Foot coplanarity
ddd
-
0.080
-
Foot position
Rev. 0 8/07
NOTES:
1. General tolerance. Distance: ±0.1000, Angle: ±2.5°
2. Matte finish on package body surface except ejection and pin 1
marking: Ra0.8~2.0um
3. All molded body sharp corner radii unless otherwise specified:
MAX. R0.200
4. Package/lead frame misalignment (X, Y): MAX. 0.127
5. Top/bottom package misalignment (X, Y): MAX. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7. Compliant to JEDEC standard MS-026.
T
T1
SECTION B-B
b
b1
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