参数资料
型号: ISPPAC-POWR604-01TN44E
厂商: Lattice Semiconductor Corporation
文件页数: 28/30页
文件大小: 0K
描述: IC ISP POWER MGR ANLG/LOG 44TQFP
标准包装: 160
系列: ispPAC®
应用: 电源监控器,序列发生器
输入电压: 0 V ~ 6 V
电源电压: 2.25 V ~ 5.5 V
电流 - 电源: 10mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 44-LQFP
供应商设备封装: 44-TQFP(10x10)
包装: 托盘
Lattice Semiconductor
Package Diagrams
44-Pin TQFP (Dimensions in Millimeters)
PIN 1 INDICATOR
0.20 C A-B
D
A
E
B
D 44X
E1
ispPAC-POWR604 Data Sheet
e
3
8
D
3
D1
TOP VIEW
4X
0.20 H A-B
D
BOTTOM VIEW
SIDE VIEW
SEE DETAIL 'A'
b
0.20 M C A-B
D
SEATING PLANE
C
H
GAUGE PLANE
b
LEAD FINISH
0.10 C
A
A2
B
B
0.25
c
c 1
A1
0.20 MIN.
0-7 ∞
L
1.00 REF.
b
1
BASE METAL
DETAIL 'A'
NOTES:
SECTION B-B
SYMBOL
A
A1
MIN.
-
0.05
NOM.
-
-
MAX.
1.60
0.15
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.
3.
4.
ALL DIMENSIONS ARE IN MILLIMETERS.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
A2
D
D1
E
E1
1.35
1.40
12.00 BSC
10.00 BSC
12.00 BSC
10.00 BSC
1.45
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
L
0.45
0.60
0.75
OF THE PACKAGE BY 0.15 MM.
N
44
6.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
e
0.80 BSC
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
b
0.30
0.37
0.45
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
b1
0.30
0.35
0.40
TO THE LOWEST POINT ON THE PACKAGE BODY.
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
c
c1
0.09
0.09
0.15
0.13
0.20
0.16
2-27
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