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| 型号： | KIT33887DWBEVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 8/37页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL 33887 5A H-BRIDGE SOIC |
| 标准包装： | 1 |
| 主要目的： | 电源管理，H 桥驱动器（内部 FET） |
| 嵌入式： | 否 |
| 已用 IC / 零件： | MC33887 |
| 主要属性： | 5A 5 ~ 28V PWM 至 20kHz 有源电流限制 |
| 次要属性： | 故障状态，睡眠模式，比例电流镜像输出 |
| 已供物品： | 板，CD |
| 相关产品： | MC33887DWBR2-ND - IC H-BRIDGE 5A LOAD FDBK 54-SOIC MC33887VWR2-ND - IC H-BRIDGE 5.0A W/CS 20-HSOP MC33887PNBR2-ND - IC H-BRIDGE 5A CURR FDBK 36-PQFN MC33887PNB-ND - IC H-BRIDGE CURR FDBK 5A 36-PQFN MC33887DHR2-ND - IC H-BRIDGE 5A CURR FDBK 20-HSOP MC33887VW-ND - IC H-BRIDGE 5.0A W/CS 20-HSOP MC33887DWB-ND - IC H-BRIDGE 5.0A W/CS 54-SOIC MC33887DH-ND - IC H-BRIDGE 5.0A W/CS 20-HSOP |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS (9) , (10) , (11) , (12)
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R θ JB
R θ JA
~7.0
~8.0
~9.0
~ 41
~ 50
~ 62
° C/W
° C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
Junction-to-Case (Exposed Pad) (15)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R θ JMA
R θ JC
~ 18
~ 21
~ 23
~ 0.8
~1.2
~2.0
° C/W
° C/W
Notes
9 The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
10 Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R θ JB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die
temperature represents ~ 16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R θ JC -total must be
less than 5.0 °C/W for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
11 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
12 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
13 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
14 Per JEDEC JESD51-6 with the board horizontal.
15 Indicates the maximum thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
33887
Analog Integrated Circuit Device Data
8
Freescale Semiconductor
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相关代理商/技术参数 |
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|---|---|
| KIT33887EKEVBE | 功能描述:电源管理IC开发工具 33887DWB FIESTA EVAL KIT RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| KIT33887EKEVBE | 制造商:Freescale Semiconductor 功能描述:5.2A 20KHz Inductive load driver w/ Curr |
| KIT33887PNBEVB | 功能描述:电源管理IC开发工具 33887 FIESTA PNB KIT RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| KIT33903BD3EVBE | 功能描述:界面开发工具 3V DUAL LIN EVB KIT RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| KIT33903BD5EVBE | 功能描述:界面开发工具 5V DUAL LIN EVB KIT RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
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